Products
Home > Products > XC7S50-1FTGB196C

XC7S50-1FTGB196C Manufacturers

Our rewards are lessen selling prices,dynamic sales team,specialized QC,solid factories,high quality services for XC7S50-1FTGB196C, Any calls for from you'll be paid with our best interest!
XC7S50-1FTGB196C, They are sturdy modeling and promoting effectively all over the world. Never ever disappearing major functions within a quick time, it's a have to for you of fantastic good quality. Guided by the principle of Prudence, Efficiency, Union and Innovation. the corporation. ake an excellent efforts to expand its international trade, raise its organization. rofit and raise its export scale. We are confident that we have been going to have a bright prospect and to be distributed all over the world in the years to come.

Related Products

Hot Products

  • XC2S50-5PQG208C

    XC2S50-5PQG208C

    XC2S50-5PQG208C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XCVU3P-2FFVC1517E

    XCVU3P-2FFVC1517E

    ​XCVU3P-2FFVC1517E is a high-performance FPGA based on the UltraScale architecture, produced by Xilinx. Here is a detailed introduction about XCVU3P-2FFVC1517E
  • EP4CGX150CF23I7

    EP4CGX150CF23I7

    EP4CGX150CF23I7 is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC6VLX75T-2FFG784I

    XC6VLX75T-2FFG784I

    ​The XC6VLX75T-2FFG784I series supports high-performance, computationally intensive electronic system developers to design "greener" products in the face of shorter design cycles and lower development cost pressures. This series includes multiple sub series products, among which Virtex ®- 6 LXT FPGA is developed for high-performance logic and DSP with low-power serial connection capabilities.
  • Buried Copper Coin PCB

    Buried Copper Coin PCB

    The so-called Buried Copper Coin PCB is a PCB board in which a copper Coin is partially embedded on the PCB. The heating elements are directly attached to the surface of the copper Coin board, and the heat is transferred out through the copper Coin.
  • BCM53426A0KFSBG

    BCM53426A0KFSBG

    BCM53426A0KFSBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • Related Blog
  • Reviews

  • 5G base stations require high-frequency and high-speed circuits, PCB has become a popular product line in the 5G era

    PCB (Printed Circuit Board) is an industry with a relatively low technical threshold. However, 5G communication has the characteristics of high frequency and high speed. Therefore, 5G PCB requires higher technology and the industry threshold is raised; at the same time, the output value is also pulled up.

  • Polar models enhanced resistance for flexible PCBs

    Now Si8000m and Si9000e also have the new option of XFE cross modeling function, Polar Instruments can provide. More than 98% of PCB manufacturers including Hongtai use Polar.

  • Current status of semiconductor chips in China

    What is the status of Chinese chips On June 9, 2021, at the world semiconductor conference, Wu Hanming, an academician of the Chinese Academy of engineering, pointed out the current situation of China's chips: China still needs 8 SMIC's if it wants to complete the localization and replacement of chips. In short, now China needs 8 SMIC's

  • Installation mode of components on PCB printed circuit board

    Our common computer boards and cards are basically epoxy resin glass cloth based double-sided printed circuit boards. One side is the plug-in components, and the other side is the welding surface of the component feet. It can be seen that the welding points are very regular

  • Detailed explanation of Multilayer PCB laminated structure

    Before designing multi-layer PCB circuit board, the designer needs to first determine the circuit board structure according to the scale of the circuit, the size of the circuit board and the requirements of electromagnetic compatibility (EMC),

  • Precautions for processing covering film of FPC circuit board

    The covering film of FPC circuit board shall be processed by opening the window, but it cannot be processed immediately after being taken out from the cold storage. Especially when the ambient temperature is high and the temperature difference is large, water droplets will condense on the surface.

Send Inquiry