XC7S50-1CSGA324I Manufacturers

Our development depends on the advanced equipment, excellent talents and continuously strengthened technology forces for XC7S50-1CSGA324I, For high-quality gas welding & cutting equipment supplied on time and at the right value, you can count on organization name.
XC7S50-1CSGA324I, Our organization. Situated inside the national civilized cities, the visitors is very easy, unique geographical and economic situations. We pursue a "people-oriented, meticulous manufacturing, brainstorm, construct brilliant" organization. hilosophy. Strict top quality management, fantastic service, reasonable cost in Myanmar is our stand on the premise of competition. If vital, welcome to make contact with us by our web page or telephone consultation, we're likely to be happy to serve you.

Hot Products

XCVU5P-3FLVB2104E
XCVU5P-3FLVB2104E is an FPGA (Field Programmable Gate Array) chip produced by Xilinx (or AMD/Xilinx, as AMD acquired Xilinx in 2019). Here is a brief introduction to the chip:
XC7K70T-3FBG484E
XC7K70T-3FBG484E is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
XCZU49DR-2FSVF1760I
XCZU49DR-2FSVF1760I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
XC7VX690T-2FFG1158I
XC7VX690T-2FFG1158I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
EPM570T144C5N
EPM570T144C5N is a microcontroller produced by ALTERA In addition, EPM570T144C5N also supports RoHS standards, ensuring the environmental friendliness of the product. These characteristics make it suitable for various application scenarios that require high-performance microcontrollers
MTFDKBA256TFK-1BC15ABFA
MTFDKBA256TFK-1BC15ABFA is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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Difference between missing printing covering layer and laminated covering film of FPC circuit board
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DHI board surface treatment technology carbon series direct plating
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XC7S50-1CSGA324I Manufacturers

Related Products

Hot Products

XCVU5P-3FLVB2104E

XC7K70T-3FBG484E

XCZU49DR-2FSVF1760I

XC7VX690T-2FFG1158I

EPM570T144C5N

MTFDKBA256TFK-1BC15ABFA

Difference between missing printing covering layer and laminated covering film of FPC circuit board

DHI board surface treatment technology carbon series direct plating

Semiconductor refers to a material whose conductivity can be controlled, ranging from insulator to conductor

The development path of Chinese PCB companies

Intel's strongest black technology strikes: Flash cache debut

C919 Chinese people just made a shell? Let's see what the insiders say

Myrna 2022-05-23 01:06:39

Ada 2022-09-28 21:36:43

Miriam 2020-11-18 14:04:13

Phyllis 2021-06-14 06:44:57

Bernice 2020-09-25 13:41:32

John 2022-10-23 16:02:16

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An Integrated Circuit (IC) functions by integrating various electronic components onto a semiconductor material, typically silicon.

After the board surface is oxidized, a fluff layer (copper oxide and cuprous oxide) is formed.