Products
Home > Products > XC7A50T-2FTG256C

XC7A50T-2FTG256C Manufacturers

We have state-of-the-art tools. Our products are exported towards the USA, the UK and so on, enjoying a fantastic reputation amongst customers for XC7A50T-2FTG256C, And there are quite a few international friends who came for sight seeing, or entrust us to buy other stuff for them. You might be most welcome to arrive to China, to our city also to our factory!
XC7A50T-2FTG256C, Our solutions have national accreditation standards for experienced, premium quality items, affordable value, was welcomed by people around the globe. Our goods will continue to increase in the order and look forward to cooperation with you, Really should any of those products be of interest to you, please letus know. We are going to be pleased to give you a quotation up on receipt of one's detailed specifications.

Related Products

Hot Products

  • BCM68901IMLG

    BCM68901IMLG

    BCM68901IMLG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7Z020-3CLG484E

    XC7Z020-3CLG484E

    ​The XC7Z020-3CLG484E embedded system on chip (SoC) adopts a dual core ARM Cortex-A9 processor configuration, integrating 7 series programmable logic (up to 6.6M logic units and 12.5Gb/s transceiver), providing highly differentiated design for various embedded applications.
  • EM-888K PCB

    EM-888K PCB

    EM-888K PCB--The manufacturing method of multilayer board is generally made by the inner layer pattern first, and then the single or double-sided substrate is made by printing and etching method, which is included in the designated interlayer, and then heated, pressurized and bonded. As for the subsequent drilling, it is the same as the plating through-hole method of double-sided plate. It was invented in 1961.
  • BCM54220SB0IFBG

    BCM54220SB0IFBG

    BCM54220SB0IFBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • ADP323ACPZ

    ADP323ACPZ

    ADP323ACPZ is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC3S1000-4FGG456C

    XC3S1000-4FGG456C

    XC3S1000-4FGG456C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • Related Blog
  • Reviews

  • What is the C chip

    IC chip (integrated circuit) is an integrated circuit formed by putting a large number of microelectronic components (transistors, resistors, capacitors, diodes, etc.) on a plastic base to make a chip. At present, almost all chips can be called IC chips.

  • What is semiconductor

    There are many forms of matter, such as solid, liquid, gas, plasma and so on. We usually call materials with poor conductivity, such as coal, artificial crystal, amber, ceramics and so on, insulators. Metals with good conductivity, such as gold, silver, copper, iron, tin and aluminum, are called conductors. The material between conductor and insulator can be simply called semiconductor. Compared with conductors and insulators, the discovery of semiconductor materials is the latest. Until the 1930s, when the purification technology of materials was improved, the existence of semiconductors was really recognized by the academic community.

  • Technology of FPC circuit board shape and hole machining

    At present, punching is the most used in batch processing of FPC circuit boards, and NC drilling and milling is mainly used for small batch FPC circuit boards and FPC circuit board samples

  • Causes and solutions of blistering in multilayer circuit boards

    Reasons for blistering of multilayer circuit board

  • What is the future development prospect of chips in China

    Chips are also known as integrated circuits and microcircuits. Mobile phone chips are an important branch of them. All functions of smart phones currently used by everyone depend on mobile phone chips. Mobile phones without chips are even worse than bricks. It can be seen that mobile phones rely heavily on chips. Chip technology directly affects the future development of mobile communications.

  • Foxconn changes cage to Phoenix and wants to regain market with 8K

    Guo Taiming described its acquisition of Sharp and the introduction of 8K display technology as a replacement for the phoenix. Whether this phoenix can bring Guo Taiming the expected growth and prompt Foxconn to regain the market is still to be verified.

Send Inquiry