XC6VCX75T-2FFG784I Manufacturers

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Hot Products

  • XCVU095-3FFVA2104E

    XCVU095-3FFVA2104E

    ​XCVU095-3FFVA2104E is an electronic component produced by Xilinx, belonging to the Kintex UltraScale series. This product has the following features and advantages:
  • High frequency PCB

    High frequency PCB

    High frequency PCB--Rogers is the name of a circuit board supplier, is a brand that offers a range of special boards that are often used in high frequency and RF circuits.
  • XQR4VSX55-10CF1140V

    XQR4VSX55-10CF1140V

    XQR4VSX55-10CF1140V is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7VX980T-1FF1930C

    XC7VX980T-1FF1930C

    XC7VX980T-1FF1930C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCKU060-1FFVA1517I

    XCKU060-1FFVA1517I

    ​XCKU060-1FFVA1517I has been optimized for system performance and integration under the 20nm process, and adopts single chip and next-generation stacked silicon interconnect (SSI) technology. This FPGA is also an ideal choice for DSP intensive processing required for next-generation medical imaging, 8k4k video, and heterogeneous wireless infrastructure.
  • TU-943R PCB

    TU-943R PCB

    TU-943R PCB - when wiring the multi-layer printed circuit board, as there are not many lines left in the signal line layer, adding more layers will cause waste, increase certain workload and increase the cost. To solve this contradiction, we can consider wiring on the electrical (ground) layer. First of all, the power layer should be considered, followed by the formation. Because it is better to preserve the integrity of the formation.

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