XC6SLX25-3CSG324C Manufacturers

We rely upon strategic thinking, constant modernisation in all segments, technological advances and of course upon our employees that directly participate in our success for XC6SLX25-3CSG324C, Our aim is "blazing new ground, Passing Value", in the future, we sincerely invite you to grow up with us and make a bright future together!
XC6SLX25-3CSG324C, Satisfaction and good credit to every customer is our priority. We focus on every detail of order processing for customers till they have received safe and sound products with good logistics service and economical cost. Depending on this, our products and solutions are sold very well in the countries in Africa, the Mid-East and Southeast Asia.

Hot Products

  • 6 layers ELIC HDI PCB

    6 layers ELIC HDI PCB

    Any Layer Inner Via Hole,The arbitrary interconnection between layers can meet the wiring connection requirements of high-density HDI boards. Through the setting of thermally conductive silicone sheets, the circuit board has good heat dissipation and shock resistance.The following is about 6 layers ELIC HDI PCB, I hope to help you better understand 6 layers ELIC HDI PCB.
  • EPM570F256C4N

    EPM570F256C4N

    EPM570F256C4N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCKU15P-2FFVA1156E

    XCKU15P-2FFVA1156E

    ​Xilinx XCKU15P-2FFVA1156E Kintex® UltraScale ™ Field programmable gate arrays can achieve extremely high signal processing bandwidth in mid-range devices and next-generation transceivers. FPGA is a semiconductor device based on a configurable logic block (CLB) matrix connected through a programmable interconnect system
  • ADM3485EARZ

    ADM3485EARZ

    ADM3485EARZ is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7VX485T-2FFG1157I

    XC7VX485T-2FFG1157I

    XC7VX485T-2FFG1157I is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • Teflon PCB

    Teflon PCB

    Teflon PCB (also called PTFE board, Teflon board, Teflon board) is divided into two kinds of molding and turning. The molding board is made of PTFE resin at room temperature by molding, and then sintered, Made by cooling. The PTFE turning plate is made of PTFE resin through compacting, sintering and rotary cutting.

Send Inquiry