XC6SLX25-2FTG256I Manufacturers

It really is a good way to further improve our goods and service. Our mission would be to acquire inventive items to buyers with a very good encounter for XC6SLX25-2FTG256I, We are keeping durable business relationships with more than 200 wholesalers in the USA, the UK, Germany and Canada. If you are interested in any of our products, please feel free to contact us.
XC6SLX25-2FTG256I, If you are for any reason unsure which product to select, do not hesitate to contact us and we'll be delighted to advise and assist you. This way we will be providing you with all the knowledge needed to make the best choice. Our company strictly follows "Survive by good quality, Develop by keeping good credit. " operation policy. Welcome all the clients old and new to visit our company and talk about the business. We're looking for more and more customers to create the glorious future.

Hot Products

  • BCM5235B0CH0X51

    BCM5235B0CH0X51

    BCM5235B0CH0X51 is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • High-power LED ceramic PCB

    High-power LED ceramic PCB

    High-power LED ceramic PCB--High-power LED copper-clad ceramic circuit board can effectively solve the heat dissipation problem of high-power LED thermal skew,Aluminum Nitride Ceramic base board substrate has the best overall performance and is the ideal substrate material for future high-power LEDs.
  • XCVU13P-2FHGA2104I

    XCVU13P-2FHGA2104I

    XCVU13P-2FHGA2104I is a scalable and reconfigurable acceleration platform suitable for optimizing complex workloads. It has a large amount of raw computing power and I/O flexibility, suitable for computationally intensive workloads in data center applications
  • 5M160ZE64C5N

    5M160ZE64C5N

    5M160ZE64C5N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EP3SL150F1152C4N

    EP3SL150F1152C4N

    EP3SL150F1152C4N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XC2S300E-6FG456C

    XC2S300E-6FG456C

    XC2S300E-6FG456C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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