Products
Home > Products > XC6SLX150-2FGG484C

XC6SLX150-2FGG484C Manufacturers

"Sincerity, Innovation, Rigorousness, and Efficiency" is the persistent conception of our company for the long-term to develop together with customers for mutual reciprocity and mutual benefit for XC6SLX150-2FGG484C, In a word, when you choose us, you choose a ideal existence. Welcome to visit our factory and welcome your get! For even further inquiries, remember to usually do not hesitate to make contact with us.
XC6SLX150-2FGG484C, So that you can utilize the resource from the expanding info in international trade, we welcome shoppers from everywhere on-line and offline. In spite of the good quality solutions we present, effective and satisfying consultation service is supplied by our specialist after-sale service team. Product lists and comprehensive parameters and any other info weil be sent for you timely for your inquiries. So make sure you make contact with us by sending us emails or call us if you have any questions about our corporation. ou may also get our address info from our web page and come to our company to get a field survey of our merchandise. We have been confident that we are intending to share mutual achievement and create strong co-operation relations with our companions in this marketplace. We're searching forward for your inquiries.

Related Products

Hot Products

  • XC7A15T-1CSG324C

    XC7A15T-1CSG324C

    XC7A15T-1CSG324C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC4VLX25-10FFG668C

    XC4VLX25-10FFG668C

    XC4VLX25-10FFG668C is a powerful and high-performance SoC FPGA chip. ‌‌
  • XC3SD1800A-4FGG676C

    XC3SD1800A-4FGG676C

    XC3SD1800A-4FGG676C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EPM7256AETC144-10N

    EPM7256AETC144-10N

    EPM7256AETC144-10N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XCVU190-2FLGB2104I

    XCVU190-2FLGB2104I

    ​XCVU190-2FLGB2104I Virtex ® UltraScale FPGAs: High capacity, high-performance FPGAs implemented using single-chip and next-generation SSI technology. Virtex UltraScale devices achieve the highest system capacity, bandwidth, and performance by integrating various system level functionalities to meet critical market and application requirements.
  • EP1S20F484C6

    EP1S20F484C6

    EP1S20F484C6 is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • Related Blog
  • Reviews

  • Aren't chips and semiconductors the same thing?

    Beginners may be confused by the terms "chip" and "semiconductor" and cannot distinguish their relationship. Today, Hongtai Express Electronics will focus on sorting out the connections and differences between chips and semiconductors that we often talk about.

  • Huawei Yu Chengdong: P10 sales to break 10 million to catch up with Apple

    At present, the dividend ceiling of smart phones is gradually emerging, especially the competition in the Chinese market is particularly fierce. In January, Huawei's sales were 4.72 million units, a slight decrease of 0.4%, and sales were 10.89 billion yuan, a decrease of 1.5%.

  • PCB layout principles

    Set the size of the board and frame according to the structural drawing, arrange the mounting holes, connectors and other devices that need to be positioned according to the structural elements, and give these devices non-movable attributes. Dimension the size according to the requirements of the process design specifications.

  • Causes and solutions of blistering in multilayer circuit boards

    Reasons for blistering of multilayer circuit board

  • Is Semiconductor Spring Coming? What is the current situation and future development trend of the industry?

    Recently, the semiconductor industry has received much attention. Morgan Stanley recently released a report stating that the deflation of the technology industry, coupled with long-term demand for artificial intelligence semiconductors, will trigger the next industry upward cycle for logic semiconductors. This news has inspired the semiconductor industry, and some people believe that the spring of semiconductors is not far away. So, let's analyze the current situation and future of the semiconductor industry.

  • Do you know these common costs in PCB enterprise management?

    In a certain period of time, enterprises will encounter the bottleneck of development. The operating cost has been rising, but it is difficult to find the "location" of the cost. We call it "invisible cost". 1. Meeting cost

Send Inquiry