Products
Home > Products > XC3S400AN-4FGG400I

XC3S400AN-4FGG400I Manufacturers

We rely upon strategic thinking, constant modernisation in all segments, technological advances and of course upon our employees that directly participate in our success for XC3S400AN-4FGG400I, Our aim is "blazing new ground, Passing Value", in the future, we sincerely invite you to grow up with us and make a bright future together!
XC3S400AN-4FGG400I, Excellent quality, competitive price, punctual delivery and dependable service can be guaranteed. For further inquires you should do not hesitate to contact us. Thank you - Your support continuously inspires us.

Related Products

Hot Products

  • XC7Z045-2FFG676E

    XC7Z045-2FFG676E

    ​XC7Z045-2FFG676E is a high-performance FPGA chip launched by Xilinx, which has the characteristics of high-speed processing capability, low power consumption, and high integration, and is suitable for various applications in modern communication systems. This chip is based on the ARM Cortex-A9 core
  • XCKU15P-2FFVE1517I

    XCKU15P-2FFVE1517I

    XCKU15P-2FFVE1517I is an FPGA (Field Programmable Gate Array) chip from Xilinx, which belongs to the Kintex UltraScale+ family. The chip utilizes 20nm process technology and features 1.4 million logic cells and 5,520 DSP slices.
  • B15951B0KUB92GT

    B15951B0KUB92GT

    B15951B0KUB92GT is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 10AS016E3F29I2SG

    10AS016E3F29I2SG

    10AS016E3F29I2SG is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XC6SLX75T-3FGG484I

    XC6SLX75T-3FGG484I

    XC6SLX75T-3FGG484I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7S50-2CSGA324I

    XC7S50-2CSGA324I

    ​XC7S50-2CSGA324I is an FPGA (Field Programmable Gate Array) launched by AMD/Xilinx, with the following features and specifications: Packaging form: CSPBGA-324 packaging is adopted, which is a surface mount packaging suitable for high-density integrated circuits
  • Related Blog
  • Reviews

  • Film selection of FPC circuit board

    There are three methods of resist coating: liquid resist coating method and FPC resist coating method for circuit board

  • Composition and main functions of PCB

    PCB is mainly composed of pad, through hole, mounting hole, wire, component, connector, filling

  • What are the challenges and opportunities faced by fingerprint identification FPC in the development of 5G in the United States

    The US Government Accountability Office (GAO) released a technology assessment and analysis report entitled "5G Wireless Technology" (hereinafter "Report"), which outlines the basic situation of 5G, summarizes the opportunities that 5G can bring, and finally analyzes the United States. Challenges in deploying 5G.

  • What does IC mean

    Integrated circuit (IC), sometimes called chip or microchip, is a semiconductor wafer on which thousands of micro resistors, capacitors and transistors are manufactured. An integrated circuit can function as an amplifier, oscillator, timer, counter, computer memory, or microprocessor. Specific ICs are classified as linear (Analog) or digital according to their intended applications.

  • What material is the chip mainly composed of

    Chip is the general term of semiconductor component products. Chip is also called integrated circuit and IC. What material is the chip mainly composed of? Let's have a look!

  • Huawei Yu Chengdong: P10 sales to break 10 million to catch up with Apple

    At present, the dividend ceiling of smart phones is gradually emerging, especially the competition in the Chinese market is particularly fierce. In January, Huawei's sales were 4.72 million units, a slight decrease of 0.4%, and sales were 10.89 billion yuan, a decrease of 1.5%.

Send Inquiry