XC3S1400A-4FGG484I Manufacturers

Our goal will be to offer premium quality items at competitive price ranges, and top-notch support to consumers around the planet. We are ISO9001, CE, and GS certified and strictly adhere to their high quality specifications for XC3S1400A-4FGG484I, Only for accomplish the good-quality product to meet customer's demand, all of our products have been strictly inspected before shipment.
XC3S1400A-4FGG484I, With the goal of "zero defect". To care for the environment, and social returns, care employee social responsibility as own duty. We welcome friends from all over the world to visit and guide us so that we can achieve the win-win goal together.

Hot Products

EP4SGX110HF35C3G
EP4SGX110HF35C3G is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
HI-6110PQI
HI-6110PQI Patch installation QFP Differential 3.45V 3.15V 10mm*10mm*2mm Batch: 23+ Quantity: 104PCS
BCM957416N4160C
BCM957416N4160C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
R-5795 PCB
As R-5795 PCB design is widely used in many industrial fields, in order to ensure a high first-time success rate, it is very important to learn the terms, requirements, processes and best practices of rigid flex design. TU-768 Rigid-Flex PCB can be seen from the name that rigid flex combination circuit is composed of rigid board and flexible board technology. This design is to connect the multilayer FPC to one or more rigid boards internally and / or externally.
BCM65040IMLG
BCM65040IMLG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
XCZU43DR-1FFVE1517I
XCZU43DR-1FFVE1517I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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Main Classification of Chips
According to functional classification, it can be divided into four types, mainly memory chips, microprocessors, standard chips, and complex systems on chip (SoCs). According to the types of integrated circuits, they can be divided into three categories: digital chips, analog chips, and hybrid chips.
What are the challenges and opportunities faced by fingerprint identification FPC in the development of 5G in the United States
The US Government Accountability Office (GAO) released a technology assessment and analysis report entitled "5G Wireless Technology" (hereinafter "Report"), which outlines the basic situation of 5G, summarizes the opportunities that 5G can bring, and finally analyzes the United States. Challenges in deploying 5G.
Why should PCB be cleaned?
When troubleshooting non-functional or poorly performing circuits, engineers can usually run simulations or other analysis tools to consider the circuit from the schematic level.
Forecast and analysis of market status and development prospects of China's semiconductor equipment industry in 2022
China business information network news: semiconductor is a kind of material with conductivity between conductor and insulator at normal temperature. It is also a material with controllable conductivity, ranging from insulator to conductor.
The Evolution and Impact of Integrated Circuits in Modern Electronics
The concept of integrated circuits traces its roots back to the late 1950s and early 1960s. Jack Kilby, an engineer at Texas Instruments, and Robert Noyce, co-founder of Fairchild Semiconductor and later Intel, independently conceived the idea of integrating multiple electronic components onto a single semiconductor substrate.
PCB manufacturers take you to understand the evolution of PCB production process
PCB manufacturers show you the evolution of PCB production process. In the 1950s and early 1960s, laminates mixed with different types of resins and various materials were introduced, but PCB is still single-sided. The circuit is on one side of the circuit board and the component is on the other side. Compared with the huge wiring and cable,

XC3S1400A-4FGG484I Manufacturers

Related Products

Hot Products

EP4SGX110HF35C3G

HI-6110PQI

BCM957416N4160C

R-5795 PCB

BCM65040IMLG

XCZU43DR-1FFVE1517I

Main Classification of Chips

What are the challenges and opportunities faced by fingerprint identification FPC in the development of 5G in the United States

Why should PCB be cleaned?

Forecast and analysis of market status and development prospects of China's semiconductor equipment industry in 2022

The Evolution and Impact of Integrated Circuits in Modern Electronics

PCB manufacturers take you to understand the evolution of PCB production process

Phoenix 2024-05-05 03:36:37

Adela 2024-05-12 11:47:22

Marian 2020-07-14 01:59:15

Olive 2021-01-20 21:29:11

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Moira 2023-05-18 18:28:42

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An Integrated Circuit (IC) functions by integrating various electronic components onto a semiconductor material, typically silicon.

After the board surface is oxidized, a fluff layer (copper oxide and cuprous oxide) is formed.