Products
Home > Products > TU102-875-A1

TU102-875-A1 Manufacturers

Our solutions are greatly recognized and reliable by customers and will fulfill continuously altering financial and social requirements for TU102-875-A1, The continual availability of substantial grade products and solutions in combination with our fantastic pre- and after-sales services ensures strong competitiveness in an increasingly globalized current market.
TU102-875-A1, We pay high attention to customer service, and cherish every customer. We have now maintained a strong reputation in the industry for many years. We're honest and work on building a long-term relationship with our customers.

Related Products

Hot Products

  • 15OZ Transformer PCB

    15OZ Transformer PCB

    The ultra-thick copper multilayer printed circuit board has good current carrying capacity and excellent heat dissipation. It is mainly used in network energy, communications, automobiles, high-power power supplies, clean energy solar energy, etc., so it has a broad market development scenario. The following is about 15OZ Transformer PCB related, I hope to help you better understand 15OZ Transformer PCB.
  • 5M80ZE64C5N

    5M80ZE64C5N

    5M80ZE64C5N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XCVU35P-1FSVH2892E

    XCVU35P-1FSVH2892E

    XCVU35P-1FSVH2892E is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC2S150E-6FGG456C

    XC2S150E-6FGG456C

    XC2S150E-6FGG456C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • TPS22912CYZVR

    TPS22912CYZVR

    TPS22912CYZVR is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • MT53E512M32D1ZW-046WT:B

    MT53E512M32D1ZW-046WT:B

    MT53E512M32D1ZW-046WT:B is most likely a type of memory chip or module. However, without further context or information about the product, I'm unable to provide a detailed English description of it. Please provide more context or details about the product so that I can give you a more accurate answer.
  • Related Blog
  • Reviews

  • Differences Between Through-Hole Technologies for Flexible Circuit Boards

    The difference between the excimer laser and the impact carbon dioxide laser through-hole of the flexible circuit board:

  • Addressing Coupling Capacitance in Designs

    Parasitic coupling between different nets occurs through parasitic inductance and capacitance. Coupling capacitance defines how easily signals can transfer between nets to produce a return path, crosstalk, or overall circuit impedance. Front-end design features in your circuit simulator can help you examine how the coupling capacitance in your nets will influence signal behavior.

  • The world's top three chip manufacturers

    Under the background of chip shortage, chip is becoming a crucial field in the world. In the chip industry, Samsung and Intel have always been the world's largest IDM giants (integrating design, manufacturing and sealing and testing, basically without relying on others). For a long time, the Iron Throne of global chips was fought back and forth between the two until TSMC rose and the bipolar pattern was completely broken.

  • Change of substrate size in PCB manufacturing process

    the difference between longitude and latitude causes the change of substrate size; Due to the failure to pay attention to the fiber direction during shearing, the shear stress remains in the substrate.

  • What is a high-speed PCB design?

    ‌High-speed PCB design‌ refers to circuit boards designed for transmitting high-speed signals, which are usually transmitted at speeds in GHz (gigahertz).

  • Precautions for the use of high-speed board plates you must know

    With the rapid development of electronic design and communication fields and the application of cloud computing, products have higher and higher requirements for data volume, and data transmission rates are getting faster and faster. At the same time, the performance of high-speed plates that carry data transmission is also required to be higher and higher.So what should be paid attention to when using high-speed plates?

Send Inquiry