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Via hole is also called via hole. In order to meet customer requirements, the via holes must be plugged in the PCB process. Through practice, it has been found that in the process of plugging, if the traditional aluminum sheet plugging process is changed, and the white mesh is used to complete the board surface solder mask and plugging, the PCB production can be stable and the quality is reliable.

The continuous growth of mobile phone production is driving the demand for HDI boards. China plays an important role in the world's mobile phone manufacturing industry. Since Motorola fully adopted HDI boards to manufacture mobile phones in 2002, more than 90% of mobile phone motherboards have adopted HDI boards. A research report released by market research company In-Stat in 2006 predicted that in the next five years, global mobile phone production will continue to grow at a rate of about 15%. By 2011, global mobile phone sales will reach 2 billion units.

From common electronic systems to some complex mechanical and electrical engineering systems, they are composed of a large number of parts of different specifications and types. Nowadays, with the development of PCB related technology, the application value of these parts has also been recognized by more fields. Manufacturers specializing in the design, research and development of these parts and technical process research have also entered the cooperation scope of many large brand enterprises. Next, analyze the three outstanding advantages of PCB:

The photovoltaic effect of semiconductor material is the basic principle of solar cell operation. At present, the photovoltaic application of semiconductor materials has become a hot topic and is currently the fastest growing and best developing clean energy market in the world. The main production material of solar cells is semiconductor materials,

Before designing multi-layer PCB, the designer needs to first determine the circuit board structure according to the scale of the circuit

Cutting, fillet, edge grinding, baking, inner pretreatment, coating, exposure, DES (development, etching, film removal), punching, AOI inspection, VRS repair, browning, lamination, pressing, drilling target, gong edge, drilling, copper plating, film pressing, printing, text, surface treatment, final inspection, packaging, and other processes are extremely numerous. It sounds great, but the process is so long, and there are many problems to pay attention to.