MT53E256M32D2DS-053 AAT:B Manufacturers

"Sincerity, Innovation, Rigorousness, and Efficiency" may be the persistent conception of our organization to the long-term to build together with shoppers for mutual reciprocity and mutual advantage for MT53E256M32D2DS-053 AAT:B, Accurate process devices, Advanced Injection Molding Equipment, Equipment assembly line, labs and software growth are our distinguishing feature.
MT53E256M32D2DS-053 AAT:B, By continuous innovation, we will supply you with more valuable merchandise and services, and also make a contribution for the development of the automobile industry at home and abroad. Both domestic and foreign merchants are strongly welcomed to join us to grow together.

Hot Products

  • EP2AGX95EF35I5G

    EP2AGX95EF35I5G

    EP2AGX95EF35I5G is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • TSM-DS3M PCB

    TSM-DS3M PCB

    With the rapid development of information technology, the trend of high-frequency and high-speed information processing is becoming more and more obvious. The demand for PCBs that can be used at low and high frequencies is increasing. For PCB manufacturers, timely and accurate grasp of market needs and The development trend will make the enterprise invincible. And the finished board has good dimensional stability. The following is about Ro3003 High Frequency PCB related, I hope to help you better understand TSM-DS3M PCB.
  • XC7Z045-2FFG900I

    XC7Z045-2FFG900I

    ​The Xilinx XC7Z045-2FFG900I Zynq ® -7000 SoC first generation architecture is a flexible platform that provides a fully programmable alternative to traditional ASIC and SoC users while launching new solutions. ARM® Cortex ™-
  • MT47H128M16RT-25E:C

    MT47H128M16RT-25E:C

    MT47H128M16RT-25E:C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 5CSXFC6C6U23I7N

    5CSXFC6C6U23I7N

    5CSXFC6C6U23I7N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7VX415T-2FFG1158I

    XC7VX415T-2FFG1158I

    ​XC7VX415T-2FFG1158I Field Programmable Gate Array (FPGA) is a device that uses stacked silicon interconnect (SSI) technology and can meet the system requirements of various applications. FPGA is a semiconductor device based on a configurable logic block (CLB) matrix connected through a programmable interconnect system. Suitable for applications such as 10G to 100G networks, portable radar, and ASIC prototype design.

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