Megtron6 Rigid-Flex PCB Manufacturers

We believe that long time period partnership is a result of top of the range, value added services, rich expertise and personal contact for Megtron6 Rigid-Flex PCB,8-layer N4000-13 EP Rigid-Flex PCB,EM-528K Rigid-Flex PCB, We maintain timely delivery schedules, innovative designs, top quality and transparency for our buyers. Our moto should be to supply quality goods inside of stipulated time.
Megtron6 Rigid-Flex PCB, we rely on own advantages to build a mutual-benefit commerce mechanism with our cooperative partners. As a result, we have gained a global sales network reaching the Middle East, Turkey, Malaysia and Vietnamese.

Hot Products

  • XC7VX1140T-1FLG1930I

    XC7VX1140T-1FLG1930I

    Xilinx XC7VX1140T-1FLG1930I FPGA - Field Programmable Gate Array Package / Box FCBGA-1930 Series XC7VX1140T Operating Supply Voltage 1.2 V to 3.3 V Minimum operating temperature - 40 C Maximum operating temperature + 100 C
  • XC6SLX150T-3FGG676I

    XC6SLX150T-3FGG676I

    XC6SLX150T-3FGG676I integrated circuit can be divided into round (metal case transistor package type, generally suitable for high power), flat type (good stability, small size) and dual in-line type according to the shape.
  • 5CGXFC7D6F27I7N

    5CGXFC7D6F27I7N

    5CGXFC7D6F27I7N is a field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor company. This device features 622,080 logic elements, 27 Mb of RAM, and 1,500 user input/output pins. It operates on a 1.0V to 1.2V power supply and supports various I/O standards such as single-ended I/O,
  • AD6645ASVZ-105

    AD6645ASVZ-105

    AD6645ASVZ-105 is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • AP8545R Rigid-Flex PCB

    AP8545R Rigid-Flex PCB

    AP8545R Rigid-Flex PCB refers to the combination of soft board and hard board. It is a circuit board formed by combining the thin flexible bottom layer with the rigid bottom layer, and then laminating into a single component. It has the characteristics of bending and folding. Due to the mixed use of various materials and multiple manufacturing steps, the processing time of rigid Flex PCB is longer and the production cost is higher.
  • 28-Layer 3step HDI PCB

    28-Layer 3step HDI PCB

    28-Layer 3step HDI PCB While electronic design is constantly improving the performance of the whole machine, it is also trying to reduce its size. In small portable products from mobile phones to smart weapons, "small" is a constant pursuit. High-density integration (HDI) technology can make the design of end products more compact while meeting higher standards of electronic performance and efficiency. The following is about 28 Layer 3step HDI Circuit Board related, I hope to help you better understand 28 Layer 3step HDI Circuit Board.

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