HT0200 FPC Manufacturers

It adheres to the tenet ""Honest, industrious, enterprising, innovative"" to develop new products constantly. It regards customers, success as its own success. Let us develop prosperous future hand in hand for HT0200 FPC,FPC flexible board,FPC flexible circuit board,FPC,FPC soft board, Welcome your enquiry, most effective service will likely be provided with full heart.
HT0200 FPC, By continuous innovation, we will supply you with more valuable merchandise and services, and also make a contribution for the development of the automobile industry at home and abroad. Both domestic and foreign merchants are strongly welcomed to join us to grow together.

Hot Products

  • XC6SLX16-2FTG256I

    XC6SLX16-2FTG256I

    XC6SLX16-2FTG256I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • High speed Backplane

    High speed Backplane

    A base station is a public mobile communication base station. It is an interface device for mobile devices to access the Internet. It is also a form of radio station. It refers to information between a mobile communication terminal and a mobile phone terminal in a certain radio coverage area. Transmitting radio transceiver station.The following is about Large size High speed Backplane related, I hope to help you better understand High speed Backplane
  • XCKU040-2FFVA1156E

    XCKU040-2FFVA1156E

    XCKU040-2FFVA1156E is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU7P-2FLVA2104I

    XCVU7P-2FLVA2104I

    The XCVU7P-2FLVA2104I device provides the highest performance and integrated functionality on 14nm/16nm FinFET nodes. AMD's third-generation 3D IC uses stacked silicon interconnect (SSI) technology to break the limitations of Moore's Law and achieve the highest signal processing and serial I/O bandwidth to meet the strictest design requirements. It also provides a virtual single-chip design environment to provide registered routing lines between chips to achieve operation above 600MHz and provide richer and more flexible clocks.
  • XCKU095-1FFVA1156C

    XCKU095-1FFVA1156C

    XCKU095-1FFVA1156C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 5AGTMC3D3F31I3G

    5AGTMC3D3F31I3G

    5AGTMC3D3F31I3G is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.

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