HDI Circuit board Manufacturers

BCM56680B1KFSBLG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

ELIC Rigid-Flex PCB is the interconnection hole technology in any layer. This technology is the patent process of Matsushita Electric Component in Japan. It is made of short fiber paper of DuPont's "poly aramid" product thermount, which is impregnated with high-function epoxy resin and film. Then it is made of laser hole forming and copper paste, and copper sheet and wire are pressed on both sides to form a conductive and interconnected double-sided plate. Because there is no electroplated copper layer in this technology, the conductor is only made of copper foil, and the thickness of the conductor is the same, which is conducive to the formation of finer wires.

The RF module is designed with RO4003C 20mil thickness PCB board, but RO4003C does not have UL certification. Can some applications requiring UL certification be replaced by RO4350B with the same thickness?The following is about 24G RO4003C RF PCBrelated, I hope to help you better understand 24G RO4003C RF PCB

EP4SGX110FF35C3G Using 40 nm process node technology, the Stratix IV GX transceiver FPGA has up to 531200 LEs, 27376 Kb RAM, and 1288 18x18 bit multipliers, and is equipped with 48 8.5Gbps full duplex transceivers based on clock data recovery (CDR).

XC3S200A-4FTG256I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

LTM4615EV#PBF is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.