HDI Circuit board Manufacturers

We always believe that one's character decides products' quality, the details decides products' quality ,with the REALISTIC,EFFICIENT AND INNOVATIVE team spirit for HDI Circuit board,6-layer Matte Black HDI PCB,Small BGA Via in PAD hole PCB,6-layers of any interconnected HDI PCB,any interconnected HDI PCB, We are generally looking ahead to forming effective business associations with new clientele around the world.
HDI Circuit board, Our company's main merchandise are widely used all over the world; 80% of our products exported to the United States, Japan, Europe and other markets. All stuff sincerely welcome guests come to visit our factory.

Hot Products

  • AD9082BBPZ-2D2AC

    AD9082BBPZ-2D2AC

    AD9082BBPZ-2D2AC is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • AD9625BBPZ-2.5

    AD9625BBPZ-2.5

    AD9625BBPZ-2.5 is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC3S2000-4FGG676C

    XC3S2000-4FGG676C

    XC3S2000-4FGG676C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • EP1S60F1020I6

    EP1S60F1020I6

    EP1S60F1020I6 is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCZU4EG-1SFVC784E

    XCZU4EG-1SFVC784E

    XCZU4EG-1SFVC784E based on Xilinx ® UltraScale MPSoC architecture. This series of products integrates feature rich 64 bit quad core or dual core Arm ® Cortex-A53 and dual core Arm Cortex-R5F processing system (based on Xilinx) ® UltraScale MPSoC architecture). Processing System (PS) and Xilinx Programmable Logic (PL) UltraScale architecture. In addition, it also includes on-chip memory, multi port external memory interfaces, and rich peripheral connection interfaces.
  • 5AGTFC7H3F35I4N

    5AGTFC7H3F35I4N

    5AGTFC7H3F35I4N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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