Products
Home > Products > EPM7256AETC144-10N

EPM7256AETC144-10N Manufacturers

We emphasize development and introduce new products into the market every year for EPM7256AETC144-10N, Living by quality, development by credit is our eternal pursuit, We firmly believe that after your visit we will become long-term partners.
EPM7256AETC144-10N, We have customers from more than 20 countries and our reputation has been recognized by our esteemed customers. Never-ending improvement and striving for 0% deficiency are our two main quality policies. Should you need anything, don't hesitate to contact us.

Related Products

Hot Products

  • XCZU19EG-2FFVC1760I

    XCZU19EG-2FFVC1760I

    ​XCZU19EG-2FFVC1760I Zynq™ UltraScale+ ™ MPSoC (EG) devices not only provide scalability for 64 bit processors, but also combine real-time control with software and hardware engines, supporting graphics, video, waveform, and packet processing
  • XC3S200-4FTG256C

    XC3S200-4FTG256C

    XC3S200-4FTG256C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC6VLX130T-2FFG1156C

    XC6VLX130T-2FFG1156C

    XC6VLX130T-2FFG1156C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XC7S15-2FTGB196C

    XC7S15-2FTGB196C

    XC7S15-2FTGB196C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 10AX090S3F45E2LG

    10AX090S3F45E2LG

    10AX090S3F45E2LG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • BCM65060A1IMLGT

    BCM65060A1IMLGT

    BCM65060A1IMLGT is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • Related Blog
  • Reviews

  • Main Classification of Chips

    According to functional classification, it can be divided into four types, mainly memory chips, microprocessors, standard chips, and complex systems on chip (SoCs). According to the types of integrated circuits, they can be divided into three categories: digital chips, analog chips, and hybrid chips.

  • What are the key points of high-speed board design requirements for different application scenarios?

    In different application scenarios, high-speed board design needs to closely fit its core functions and physical limitations, showing obvious differentiated emphasis.

  • Installation mode of components on PCB printed circuit board

    Our common computer boards and cards are basically epoxy resin glass cloth based double-sided printed circuit boards. One side is the plug-in components, and the other side is the welding surface of the component feet. It can be seen that the welding points are very regular

  • Semiconductor refrigeration technology

    Semiconductor refrigeration technology is widely used in the current refrigeration technology. During the growth of crops in the greenhouse, semiconductor refrigeration technology can effectively control the environmental temperature, especially for some plants with high requirements for the environment

  • Where can high-speed boards be used?

    As a key component in modern electronic devices, high-speed boards are widely used in communication, computing, consumer electronics, and industrial control.

  • Hongtai tells you why the more developed countries, the less support mobile payment?

    Hongtai tells you, why are people in these developed countries so keen on mobile payment as a convenient payment method? Because in their view, the "cashless era" with full coverage of mobile payments hides the danger of many dark waves.

Send Inquiry