EPM240F100I5N Manufacturers

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Hot Products

  • XC7K160T-L2FFG676I

    XC7K160T-L2FFG676I

    ​XC7K160T-L2FFG676I is used to connect to the host system. The 7 series devices utilize Xilinx's unified architecture to protect IP investments and can easily migrate 6 series designs. The unified architecture includes common components such as logic structure
  • MSP432P4011IRGCT

    MSP432P4011IRGCT

    MSP432P4011IRGCT is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • copper paste filled hole PCB

    copper paste filled hole PCB

    copper paste filled hole PCB: Bai AE3030 copper pulp is a non-conductive DAO copper paste used for the high-density assembly of printed substrate DU plate and the laying of wires.Due to the characteristics of Zhuan "high Thermal conductivity", "bubble-free", "flat" and so on, the copper paste is most suitable for the design of high reliability Pad on Via, stack on Via and Thermal Via. The copper paste is widely used from aerospace satellite, server, cabling machine, LED backlight and so on.
  • EP2AGX190EF29I3G

    EP2AGX190EF29I3G

    ​The EP2AGX190EF29I3G Arria ® II GX low-power 6G transceiver FPGA effectively reduces costs and power consumption, providing stronger functionality for applications based on 6G transceivers. The 40 nm Arria II series includes the lowest cost 6.375-Gbps transceiver FPGA
  • XCVU095-2FFVC2104I

    XCVU095-2FFVC2104I

    XCVU095-2FFVC2104I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EPM3128ATC144-10N

    EPM3128ATC144-10N

    EPM3128ATC144-10N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.

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