Products
Home > Products > EP4SGX360FF35C3N

EP4SGX360FF35C3N Manufacturers

It is a good way to improve our products and service. Our mission is to develop creative products to customers with a good experience for EP4SGX360FF35C3N, As a key enterprise of this industry, our corporation makes endeavours to become a leading supplier, dependant on the faith of expert quality & all over the world provider.
EP4SGX360FF35C3N, In order to meet more market demands and long-term development, a 150, 000-square-meter new factory is under construction, which will be put into use in 2014. Then, we shall own a large capacity of producing. Of course, we are going to continue improving the service system to meet the requirements of customers, bringing health, happiness and beauty to everyone.

Related Products

Hot Products

  • XC3S1400A-4FTG256I

    XC3S1400A-4FTG256I

    XC3S1400A-4FTG256I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7K410T-2FFG900I

    XC7K410T-2FFG900I

    ​XC7K410T-2FFG900I has optimized the best cost performance ratio, doubling compared to the previous generation, achieving a new class of FPGA.
  • XCZU43DR-1FFVE1156I

    XCZU43DR-1FFVE1156I

    XCZU43DR-1FFVE1156I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCZU11EG-2FFVC1760E

    XCZU11EG-2FFVC1760E

    XCZU11EG-2FFVC1760E is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 5CGXFC9E6F35C7N

    5CGXFC9E6F35C7N

    ​5CGXFC9E6F35C7N is an FPGA chip belonging to the Cyclone V GX series produced by Intel (formerly known as Altera). This chip has the following characteristics and parameters:
  • XC6SLX100-3FGG484I

    XC6SLX100-3FGG484I

    XC6SLX100-3FGG484I is an advanced field-programmable gate array (FPGA) developed by Xilinx, a leading semiconductor technology company. This device features 98,304 logic cells, 4.9 Mb of distributed RAM, 240 Digital Signal Processing (DSP) slices, and 8 clock management tiles. It requires a power supply of 1.2V to 1.5V and supports various I/O standards such as LVCMOS, LVDS, and PCI Express.
  • Related Blog
  • Reviews

  • What is the main focus of the semiconductor industry

    The semiconductor industry is a high-tech industry that involves the research and development, manufacturing, and application of semiconductor materials. Semiconductors are a special type of material with conductive properties that lie between conductors and insulators. Semiconductor materials achieve the functionality of electronic devices by controlling the flow of current.

  • FPC becomes the general trend of PCB industry

    Electronic products should use PCB. PCB (printed circuit board) is used in almost all electronic products and is considered as the "mother of electronic system products".

  • electronic component. pcb

    Printed circuit board (PCB), also known as printed circuit board, is the supplier of electrical connection of electronic components. Its development has a history of more than 100 years. Its design is mainly layout design. The main advantage of using circuit board is that it greatly reduces the wiring and assembly errors, and improves the automation level and production labor rate. According to the number of circuit board layers, it can be divided into single board, double board, four board, six board and other multilayer circuit boards.

  • Thermal stress treatment quality of heavy copper PCB

    When designing a circuit, factors such as thermal stress are very important, and engineers should eliminate thermal stress as much as possible. Over time, PCB manufacturing processes have continued to evolve, and various PCB technologies have been invented, such as aluminum PCBs, which can handle thermal stress. It is in the interests of heavy copper PCB designers to minimize the power budget while maintaining the circuit. Performance and environmentally friendly design with heat dissipation performance.

  • Technology of FPC circuit board shape and hole machining

    At present, punching is the most used in batch processing of FPC circuit boards, and NC drilling and milling is mainly used for small batch FPC circuit boards and FPC circuit board samples

  • This year, the cumulative sales of semiconductor equipment in Japan exceeded 75.6 billion, setting a record for the same period in history

    According to the news from zhidongxi on June 28, according to money DJ in Taiwan, China, the cumulative sales of semiconductor equipment in Japan exceeded RMB 75.6 billion in May this year, the highest in the same period over the years

Send Inquiry