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Our mission is to become an innovative supplier of high-tech digital and communication devices by providing value added design, world-class manufacturing, and service capabilities for EP1S30F1020C7, We hope to establish far more organization associations with consumers all over the globe.
EP1S30F1020C7, Now, we professionally supplies customers with our main products And our business is not only the "buy" and "sell", but also focus on more. We target to be your loyal supplier and long-term cooperator in China. Now, We hope to be the friends with you.

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    XC7Z020-3CLG484E

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    EM-888K PCB--The manufacturing method of multilayer board is generally made by the inner layer pattern first, and then the single or double-sided substrate is made by printing and etching method, which is included in the designated interlayer, and then heated, pressurized and bonded. As for the subsequent drilling, it is the same as the plating through-hole method of double-sided plate. It was invented in 1961.
  • BCM54220SB0IFBG

    BCM54220SB0IFBG

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    ADP323ACPZ

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  • XC3S1000-4FGG456C

    XC3S1000-4FGG456C

    XC3S1000-4FGG456C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
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  • What is the C chip

    IC chip (integrated circuit) is an integrated circuit formed by putting a large number of microelectronic components (transistors, resistors, capacitors, diodes, etc.) on a plastic base to make a chip. At present, almost all chips can be called IC chips.

  • What is semiconductor

    There are many forms of matter, such as solid, liquid, gas, plasma and so on. We usually call materials with poor conductivity, such as coal, artificial crystal, amber, ceramics and so on, insulators. Metals with good conductivity, such as gold, silver, copper, iron, tin and aluminum, are called conductors. The material between conductor and insulator can be simply called semiconductor. Compared with conductors and insulators, the discovery of semiconductor materials is the latest. Until the 1930s, when the purification technology of materials was improved, the existence of semiconductors was really recognized by the academic community.

  • Technology of FPC circuit board shape and hole machining

    At present, punching is the most used in batch processing of FPC circuit boards, and NC drilling and milling is mainly used for small batch FPC circuit boards and FPC circuit board samples

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    Reasons for blistering of multilayer circuit board

  • What is the future development prospect of chips in China

    Chips are also known as integrated circuits and microcircuits. Mobile phone chips are an important branch of them. All functions of smart phones currently used by everyone depend on mobile phone chips. Mobile phones without chips are even worse than bricks. It can be seen that mobile phones rely heavily on chips. Chip technology directly affects the future development of mobile communications.

  • Foxconn changes cage to Phoenix and wants to regain market with 8K

    Guo Taiming described its acquisition of Sharp and the introduction of 8K display technology as a replacement for the phoenix. Whether this phoenix can bring Guo Taiming the expected growth and prompt Foxconn to regain the market is still to be verified.

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