C1206C106K3RACAUTO7210 Manufacturers

Sticking for the basic principle of "Super Top quality, Satisfactory service" ,We've been striving to be an excellent business enterprise partner of you for C1206C106K3RACAUTO7210, Prospects first! Whatever you require, we should do our utmost to help you. We warmly welcome clients from all around the globe to cooperate with us for mutual enhancement.
C1206C106K3RACAUTO7210, Regarding quality as survival, prestige as guarantee, innovation as motive force, development along with advanced technology, our group hopes to make progress together with you and make untiring efforts for the bright future of this industry.

Hot Products

  • XCVU7P-L2FLVB2104E

    XCVU7P-L2FLVB2104E

    XCVU7P-L2FLVB2104E The device provides the highest performance and integrated functionality on the 14nm/16nm FinFET node. AMD's third-generation 3D IC uses stacked silicon interconnect (SSI) technology to break the limitations of Moore's Law and achieve the highest signal processing and serial I/O bandwidth to meet the strictest design requirements
  • LTC2802CDE#PBF

    LTC2802CDE#PBF

    LTC2802CDE#PBF is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • CD74HCT161M

    CD74HCT161M

    CD74HCT161M is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC3S400AN-4FTG256I

    XC3S400AN-4FTG256I

    XC3S400AN-4FTG256I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU29P-3FSGA2577E

    XCVU29P-3FSGA2577E

    XCVU29P-3FSGA2577E is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XCS20-3TQ144I

    XCS20-3TQ144I

    XCS20-3TQ144I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

Send Inquiry