Broken Golden Finger PCB Manufacturers

We have state-of-the-art equipment. Our products are exported for the USA, the UK and so on, enjoying a fantastic status among the clients for Broken Golden Finger PCB,Red oil gold finger PCB,Long Short Gold Finger PCB,Gold finger PCB, If you're searching for a top quality, fast delivery, greatest following company and superior value supplier in China for long-term business partnership, we're going to be your best choice.
Broken Golden Finger PCB, Our mission is to deliver consistently superior value to our customers and their clients. This commitment permeates everything we do, driving us to continuously develop and improve our solutions and the processes to fulfill your needs.

Hot Products

  • XC3S250E-4FTG256C

    XC3S250E-4FTG256C

    XC3S250E-4FTG256C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU190-2FLGB2104I

    XCVU190-2FLGB2104I

    ​XCVU190-2FLGB2104I Virtex ® UltraScale FPGAs: High capacity, high-performance FPGAs implemented using single-chip and next-generation SSI technology. Virtex UltraScale devices achieve the highest system capacity, bandwidth, and performance by integrating various system level functionalities to meet critical market and application requirements.
  • Large size PCB

    Large size PCB

    Large size PCB super big size pcb-oil rig main board:board thickness 4.0mm, 4layer, L1-L2 blind hole, L3-L4 blind hole, 4/4/4/4oz copper, Tg170, single panel size 820*850mm. oil rig main board:board thickness 4.0mm, 4layer, L1-L2 blind hole, L3-L4 blind hole, 4/4/4/4oz copper, Tg170, single panel size 820*850mm.
  • MT41K1G8SN-125:A

    MT41K1G8SN-125:A

    MT41K1G8SN-125:A is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC3S700A-4FGG484C

    XC3S700A-4FGG484C

    XC3S700A-4FGG484C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU29P-3FSGA2577E

    XCVU29P-3FSGA2577E

    XCVU29P-3FSGA2577E is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.

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