Products
Home > Products > BCM957414A4142CC

BCM957414A4142CC Manufacturers

The customer satisfaction is our primary target. We uphold a consistent level of professionalism, quality, credibility and service for BCM957414A4142CC, Honesty is our principle, professional operation is our work, service is our goal, and customers' satisfaction is our future!
BCM957414A4142CC, We have been sincerely looking forward to cooperate with customers all over the world. We believe we can satisfy you with our high-quality products and solutions and perfect service . We also warmly welcome customers to visit our company and purchase our products.

Related Products

Hot Products

  • DIX4192IPFBRQ1

    DIX4192IPFBRQ1

    DIX4192IPFBRQ1 is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC3SD1800A-4FGG676C

    XC3SD1800A-4FGG676C

    XC3SD1800A-4FGG676C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC3S500E-4FGG320C

    XC3S500E-4FGG320C

    XC3S500E-4FGG320C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XC6SLX150T-3FGG676I

    XC6SLX150T-3FGG676I

    XC6SLX150T-3FGG676I integrated circuit can be divided into round (metal case transistor package type, generally suitable for high power), flat type (good stability, small size) and dual in-line type according to the shape.
  • XC2VP40-5FF1152I

    XC2VP40-5FF1152I

    XC2VP40-5FF1152I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EP3C80U484I7N

    EP3C80U484I7N

    EP3C80U484I7N is a field programmable gate array (FPGA) chip designed by Altera. It has 484 I/O pins and supports multiple input/output interfaces such as LVDS, LVCMOS, LVTTL, etc. In addition, EP3C80F484I7N also has strong logical processing capabilities, which can implement various complex digital signal processing algorithms
  • Related Blog
  • Reviews

  • PCB production, these matters you must pay attention to!

    People who make circuit boards know that the production process is very complex~

  • What is a semiconductor

    If the substance is distinguished by conductivity, it can be roughly classified into two types

  • Development of integrated circuits

    The most advanced integrated circuit is the core of microprocessor or multi-core processor, which can control everything from computer to mobile phone to digital microwave oven. Although the cost of designing and developing a complex

  • Differences Between Through-Hole Technologies for Flexible Circuit Boards

    The difference between the excimer laser and the impact carbon dioxide laser through-hole of the flexible circuit board:

  • The world's top three chip manufacturers

    Under the background of chip shortage, chip is becoming a crucial field in the world. In the chip industry, Samsung and Intel have always been the world's largest IDM giants (integrating design, manufacturing and sealing and testing, basically without relying on others). For a long time, the Iron Throne of global chips was fought back and forth between the two until TSMC rose and the bipolar pattern was completely broken.

  • Classification of electronic components

    Components: products that do not change the molecular composition of raw materials during processing can be called components.

Send Inquiry