Products
Home > Products > BCM81128A1KRFBG

BCM81128A1KRFBG Manufacturers

Our corporation has been specializing in brand strategy. Customers' gratification is our greatest advertising. We also source OEM company for BCM81128A1KRFBG, As we're moving forward, we continue to keep an eye on our ever-expanding merchandise range and make improvement to our services.
BCM81128A1KRFBG, Welcome to visit our company and factory, there are various items displayed in our showroom that will meet your expectation, meanwhile, if you are convenient to visit our website, our sales staff will try their efforts to supply you the best service

Related Products

Hot Products

  • XCKU060-2FFVA1517I

    XCKU060-2FFVA1517I

    ​XCKU060-2FFVA1517I has been optimized for system performance and integration under the 20nm process, and adopts single chip and next-generation stacked silicon interconnect (SSI) technology. This FPGA is also an ideal choice for DSP intensive processing required for next-generation medical imaging, 8k4k video, and heterogeneous wireless infrastructure.
  • XCKU5P-2FFVB676I

    XCKU5P-2FFVB676I

    XCKU5P-2FFVB676I is a high-performance FPGA (Field-Programmable Gate Array) chip from Xilinx's Kintex UltraScale+ family. It features 5.3 million logic cells, 113 Mb of UltraRAM and 2,722 DSP slices, and utilizes the 20nm process technology with FinFET+ technology, providing high performance and energy efficiency.
  • BCM88681CA1KFSBG

    BCM88681CA1KFSBG

    BCM88681CA1KFSBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • BCM88797CB0KFSBG

    BCM88797CB0KFSBG

    BCM88797CB0KFSBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 5SGXMABK2H40I3LN

    5SGXMABK2H40I3LN

    5SGXMABK2H40I3LN is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • MT25QU128ABA1EW9-0SIT

    MT25QU128ABA1EW9-0SIT

    MT25QU128ABA1EW9-0SIT is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • Related Blog
  • Reviews

  • Why HDI PCB needs to be browned and what is its function？

    We all know that there are many procedures for making HDI PCB from the planned feeding to the final step. One of the processes is called browning. Some people may ask what is the role of browning?

  • Differences Between Through-Hole Technologies for Flexible Circuit Boards

    The difference between the excimer laser and the impact carbon dioxide laser through-hole of the flexible circuit board:

  • What are the challenges and opportunities faced by fingerprint identification FPC in the development of 5G in the United States

    The US Government Accountability Office (GAO) released a technology assessment and analysis report entitled "5G Wireless Technology" (hereinafter "Report"), which outlines the basic situation of 5G, summarizes the opportunities that 5G can bring, and finally analyzes the United States. Challenges in deploying 5G.

  • Introduction of chip

    Chip, also known as microcircuit, microchip, integrated circuit (IC). It refers to the silicon chip containing integrated circuits, which is very small and often part of computers or other electronic equipment.

  • The characteristics of rigid-flex board

    Rigid-flex board is a combination of flexible board and hard board. It is a circuit board formed by combining a thin layered flexible bottom layer with a rigid bottom layer, and then laminating it into a single component.The flexible board is used to replace the cable assembly to complete the highly reliable connection and transmission of power and electrical signals.The product can work stably and reliably for a long time under harsh environments such as high and low temperature, high humidity, vibration, salt spray, and low air pressure. At present, Jonhon Optronic has provided rigid and flexible printed board solutions for aviation, aerospace, ships, weapons and other fields.

  • FPC circuit board manufacturing process

    Flow chart of single-sided FPC circuit board: engineering documents - copper foil - Pretreatment - press dry film - exposure - Development - etching - film stripping - AOI - Pretreatment - coating film (or ink printing) - pretreatment before electroplating - electroplating - post electroplating - reinforcement - appearance punching - electrical measurement - appearance inspection - shipment;

Send Inquiry