BCM65239C0IFSBG Manufacturers

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Hot Products

  • TPS79318DBVR

    TPS79318DBVR

    TPS79318DBVR is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • MT62F1536M64D8WT-031 XT:B

    MT62F1536M64D8WT-031 XT:B

    MT62F1536M64D8WT-031 XT:B is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • MT47H64M8SH-25E:H

    MT47H64M8SH-25E:H

    ​MT47H64M8SH-25E:H is a type of synchronous dynamic random-access memory (SDRAM) chip produced by Micron Technology. It has a capacity of 512 megabytes (MB) and a maximum clock speed of 200 megahertz (MHz). The chip operates at a voltage of 2.5
  • MT41K512M16HA-125 AIT:A

    MT41K512M16HA-125 AIT:A

    MT41K512M16HA-125 AIT:A is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC3S200AN-4FTG256C

    XC3S200AN-4FTG256C

    XC3S200AN-4FTG256C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • TU-1300E PCB

    TU-1300E PCB

    TU-1300E PCB -- expedition unified design environment combines FPGA design and PCB design completely, and automatically generates schematic symbols and geometric packaging in PCB design from FPGA design results, which greatly improves the design efficiency of designers.

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