BCM65230C0IFSBG Manufacturers

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BCM65230C0IFSBG, Further, we're supported by highly experienced and knowledgeable professionals, who have immense expertise in their respective domain. These professionals work in close coordination with each other to provide our clients an effective range of products and solutions.

Hot Products

  • XC6SLX150-3FGG484C

    XC6SLX150-3FGG484C

    XC6SLX150-3FGG484C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 10AX115R3F40I2LG

    10AX115R3F40I2LG

    The 10AX115R3F40I2LG is the highest performing mid-range 20 nanometer FPGA with 96 full duplex transceivers, supporting a chip to chip data rate of 17.4Gbps. In addition, the FPGA also provides a backplane data transfer rate of up to 12.5 Gbps and up to 1.15 million equivalent logic units.
  • Buried capacitance PCB

    Buried capacitance PCB

    24-Layer Buried capacitance PCB has a process called burying resistance, which is to put chip resistors and chip capacitors into the inner layer of the PCB board. These chip resistors and capacitors are generally very small, such as 0201, or even smaller 01005. The PCB board produced in this way is the same as a normal PCB board, but a lot of resistors and capacitors are placed in it. For the top layer, the bottom layer saves a lot of space for component placement. The following is about 24 Layer Buried capacitance PCB related, I hope to help you better understand 24 Layer Buried capacitance PCB.
  • EP3C55U484I7N

    EP3C55U484I7N

    EP3C55U484I7N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCKU15P-3FFVE1517E

    XCKU15P-3FFVE1517E

    ​XCKU15P-3FFVE1517E Kintex® UltraScale+ ™ FPGA provides high cost-effectiveness in FinFET nodes, offering an economical and efficient solution for applications that require high-end functionality, including 33Gb/s transceivers and 100G connectivity cores.
  • XC7Z100-2FFG900I

    XC7Z100-2FFG900I

    XC7Z100-2FFG900I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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