Products
Home > Products > BCM56643BOKFSBLG

BCM56643BOKFSBLG Manufacturers

Sticking to the perception of "Creating products of top of the range and earning mates with people today from all over the world", we constantly put the desire of consumers in the first place for BCM56643BOKFSBLG, We sincerely welcome mates to negotiate organization and start cooperation. We hope to affix hands with good friends in different industries to produce a fantastic long term.
BCM56643BOKFSBLG, They're durable modeling and promoting well all over the world. Under no circumstances disappearing key functions in a brief time, it's a ought to in your case personally of fantastic quality. Guided by the principle of Prudence, Efficiency, Union and Innovation. the business make an awesome efforts to expand its international trade, raise its enterprise. rofit and improve its export scale. We're confident that we'll have a vibrant prospect and to be distributed all over the world in the years to come.

Related Products

Hot Products

  • LTC4357MPMS8#PBF

    LTC4357MPMS8#PBF

    LTC4357MPMS8#PBF is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC3S1000-4FGG456I

    XC3S1000-4FGG456I

    XC3S1000-4FGG456I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC3S400AN-4FGG400I

    XC3S400AN-4FGG400I

    XC3S400AN-4FGG400I is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • HDI PCB

    HDI PCB

    HDI PCB is the abbreviation of "high density interconnector", which is a kind of printed circuit board (PCB) production. It is a kind of circuit board with high line distribution density using micro blind buried hole technology.
  • EPM7128AETC100-10N

    EPM7128AETC100-10N

    EPM7128AETC100-10N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XC2VP70-6FFG1517C

    XC2VP70-6FFG1517C

    XC2VP70-6FFG1517C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • Related Blog
  • Reviews

  • PCB production, you must pay attention to these matters

    Cutting, fillet, edging, baking, inner layer pretreatment, coating, exposure, DES (development, etching, film removal), punching, AOI inspection, VRS repair, browning, lamination, pressing, target drilling, Gong edge, drilling, copper plating, film pressing, printing, writing, surface treatment, final inspection, packaging and other processes are countless

  • Distinguishing method of PCB single-layer board and multi-layer board

    According to the number of layers, single-sided, double-sided and multilayer circuit boards are divided according to the circuit layer inside.

  • Introduction to semiconductor

    Germanium, silicon, selenium, gallium arsenide and many metal oxides, metal sulfides and other objects, whose conductivity is between conductor and insulator, are called semiconductors. Semiconductors have some special properties. For example, the thermistor (thermistor) for automatic control can be made by using the relationship between the resistivity and temperature of the semiconductor; Using its photosensitive characteristics, photosensitive elements for automatic control can be made, such as photocells, photocells and photoresistors

  • Causes and solutions of blistering in multilayer circuit boards

    Reasons for blistering of multilayer circuit board

  • The advantages of heavy copper PCB

    The advantages of heavy copper PCB make it the top priority for the development of high-power circuits. The heavy copper concentration can handle high power and high heat, which is why high-power circuits have been developed using this technology. Such circuits cannot be developed with low-copper concentration PCBs because they cannot withstand the huge thermal stresses caused by high currents and flowing currents.

  • 2017 Hongtai bids farewell to Shenzhen to settle in the Fourth Guangdong Association

    Hongtai was also affected. Japanese companies have reached a strategic cooperation relationship, and officially entered the four meetings in 2017 ...

Send Inquiry