AP8515E Rigid-Flex PCB Manufacturers

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Hot Products

  • XC7A15T-2CPG236I

    XC7A15T-2CPG236I

    XC7A15T-2CPG236I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC3S1500-4FGG676I

    XC3S1500-4FGG676I

    XC3S1500-4FGG676I is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • 8-layer gold finger PCB

    8-layer gold finger PCB

    The 8-layer gold finger PCB is actually coated with a layer of gold on the copper clad laminate by a special process, because the gold has strong oxidation resistance and strong conductivity.
  • Ic carrier

    Ic carrier

    IC carrier: generally, it is a board on the chip. The board is very small, generally, it is 1/4 nail cover size, and the board is very thin 0.2-0. The material used is FR-5, BT resin, and its circuit is about 2mil / 2mil. For high-precision boards, it used to be produced in Taiwan, but now it is developing to the mainland.
  • XC6SLX16-2FTG256I

    XC6SLX16-2FTG256I

    XC6SLX16-2FTG256I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCKU3P-2FFVD900I

    XCKU3P-2FFVD900I

    ​XCKU3P-2FFVD900I is an electronic component produced by Xilinx, available in BGA packaging with batch numbers 21+and 22+. This component belongs to the FPGA (Field Programmable Gate Array) category and is suitable for various electronic devices and systems.

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