Any interconnect HDI PCB Manufacturers

Our personnel are generally in the spirit of "continuous improvement and excellence", and together with the outstanding top quality merchandise, favorable price tag and fantastic after-sales solutions, we try to gain every single customer's rely on for Any interconnect HDI PCB,VIA-in-PAD PCB,VIA in PAD PCB,HDI PCB,ELIC HDI PCB, Warmly welcome to cooperate and develop with us! we will continue to provide product with high quality and competitive price.
Any interconnect HDI PCB, Over the years, with high-quality solutions, first- class service, ultra-low prices we win thee trust and favor of customers. Nowadays our products sell all over the domestic and abroad. Thanks for the regular and new customers support. We offer high quality product and competitive price, welcome the regular and new customers cooperate with us!

Hot Products

  • LTM4620IV#PBF

    LTM4620IV#PBF

    LTM4620IV#PBF is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCKU5P-1FFVB676E

    XCKU5P-1FFVB676E

    ​XCKU5P-1FFVB676E is an FPGA (Field Programmable Gate Array) produced by AMD/Xilinx, belonging to Kintex ® UltraScale+FPGA series. This FPGA has multiple power options to achieve the best balance between required system performance and extremely low power consumption. It offers excellent cost-effectiveness, performance,
  • AD104-895-A1

    AD104-895-A1

    AD104-895-A1 is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • T520D477M006ATE025

    T520D477M006ATE025

    T520D477M006ATE025 is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • ELIC Rigid-Flex PCB

    ELIC Rigid-Flex PCB

    ELIC Rigid-Flex PCB is the interconnection hole technology in any layer. This technology is the patent process of Matsushita Electric Component in Japan. It is made of short fiber paper of DuPont's "poly aramid" product thermount, which is impregnated with high-function epoxy resin and film. Then it is made of laser hole forming and copper paste, and copper sheet and wire are pressed on both sides to form a conductive and interconnected double-sided plate. Because there is no electroplated copper layer in this technology, the conductor is only made of copper foil, and the thickness of the conductor is the same, which is conducive to the formation of finer wires.
  • XC3S400-4FGG456C

    XC3S400-4FGG456C

    ​XC3S400-4FGG456C is an FPGA chip produced by Xilinx and belongs to the Spartan-3 series. This chip has multiple significant features that make it widely used in multiple fields.

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