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    Multilayer PCB circuit board

    Multilayer PCB circuit board--The manufacturing method of multilayer board is generally made by the inner layer pattern first, and then the single or double-sided substrate is made by printing and etching method, which is included in the designated interlayer, and then heated, pressurized and bonded. As for the subsequent drilling, it is the same as the plating through-hole method of double-sided plate. It was invented in 1961.
  • XC4VSX35-11FF668C

    XC4VSX35-11FF668C

    ​XC4VSX35-11FF668C is a Virtex-4 series FPGA chip produced by Xilinx. This chip adopts FCBGA packaging, which has high performance and flexibility, and is widely used in communication, data processing, image processing and other fields. Its main features include supporting rich logical units and I/O resources,
  • XCZU42DR-L2FSVE1156I

    XCZU42DR-L2FSVE1156I

    XCZU42DR-L2FSVE1156I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 10AX115H3F34I2SG

    10AX115H3F34I2SG

    ​10AX115H3F34I2SG adopts a 20 nanometer process, which can provide high performance, supporting chip to chip data transmission rates of up to 17.4 Gbps, backplane data transmission rates of up to 12.5 Gbps, and up to 1.15 million equivalent logic units.
  • EPM7128SQI100-10N

    EPM7128SQI100-10N

    EPM7128SQI100-10N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7VX980T-1FFG1926C

    XC7VX980T-1FFG1926C

    XC7VX980T-1FFG1926C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
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  • How to design a PCB for high frequency?

    Designing a PCB (Printed Circuit Board) for high-frequency applications requires careful consideration of various factors to ensure signal integrity, minimize losses, and mitigate electromagnetic interference. Here are some key steps and considerations:

  • What are the benefits of semiconductors?

    IC refers to integrated circuits. In semiconductor, semiconductor is the most suitable material to realize transistor, and transistor is the core device of most circuits. But I want to write more here, starting from the beginning of "circuit". In physics class, everyone heard that Maxwell's equation predicted the existence of electromagnetic wave, and then Hertz's experiment proved the existence of electromagnetic wave. Finally, Marconi realized radio communication

  • T/CPCA 6044-2017 "Printed Board Safety Performance Specification" Release Notice

    With the development of printed circuit board technology and its applications, the industry has put forward more new requirements for the safety of printed circuit boards. Therefore, it is necessary to establish a safety standard that belongs to China's printed circuit boards.

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    PCB is mainly composed of pad, through hole, mounting hole, wire, component, connector, filling

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    Just as steel supports the industry, chips support the information industry. Chip R&D and manufacturing capability is the embodiment of a country's high, sophisticated and cutting-edge technology development level.

  • The advantages of heavy copper PCB

    The advantages of heavy copper PCB make it the top priority for the development of high-power circuits. The heavy copper concentration can handle high power and high heat, which is why high-power circuits have been developed using this technology. Such circuits cannot be developed with low-copper concentration PCBs because they cannot withstand the huge thermal stresses caused by high currents and flowing currents.

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