Products
Home > Products > 5AGXFA5H4F35I3G

5AGXFA5H4F35I3G Manufacturers

Reliable top quality and great credit score standing are our principles, which will help us at a top-ranking position. Adhering on the tenet of "quality first, consumer supreme" for 5AGXFA5H4F35I3G, Sincerely stay up for serving you from the in the vicinity of future. You are sincerely welcome to go to our company to talk company face to face with each other and create long-term co-operation with us!
5AGXFA5H4F35I3G, we sincerely hope to establish a good and long-term business relationship with your esteemed company through this opportunity, based on equality, mutual benefit and win-win business from now to the future. "Your satisfaction is our happiness".

Related Products

Hot Products

  • XC7K410T-2FFG900l

    XC7K410T-2FFG900l

    XC7K410T-2FFG900l I is a high-performance programmable logic device (FPGA) launched by Xilinx. This FPGA belongs to Xilinx's seventh generation Kintex series and is manufactured using TSMC's 28 nanometer process, with advanced processing capabilities and powerful logic resources
  • XC7VX690T-3FFG1157E

    XC7VX690T-3FFG1157E

    XC7VX690T-3FFG1157E is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCZU7EG-1FBVB900E

    XCZU7EG-1FBVB900E

    XCZU7EG-1FBVB900E is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC6SLX9-3FTG256I

    XC6SLX9-3FTG256I

    XC6SLX9-3FTG256I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7VX690T-2FFG1157I

    XC7VX690T-2FFG1157I

    XC7VX690T-2FFG1157I is a high-performance FPGA chip produced by Xilinx, belonging to the Virtex-7 series. The chip is manufactured using a 28nm process and has 693120 logic elements and 108300 adaptive logic modules, supporting data rates of up to 28.05Gb/s.
  • XC7K410T-1FBG900I

    XC7K410T-1FBG900I

    XC7K410T-1FBG900I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • Related Blog
  • Reviews

  • Why semiconductors are so important

    The semiconductor industry originated in the late 20th century and has become one of the most important parts of the global economy. Nowadays, almost every electronic device has semiconductors

  • FPC flexible circuit board through hole mode

    At present, most of the holes drilled in the double-sided flexible printed board are still drilled by the NC drilling machine. The NC drilling machine is basically the same as that used in the rigid printed board, but the drilling conditions are different. Because the flexible printed board is very thin, multiple pieces can be overlapped for drilling. If the drilling conditions are good, 10 ~ 15 pieces can be overlapped for drilling.

  • 2017 Huawei Supplier Conference Award Presentation

    With the full-scale production of the Dongcheng factory, Shengyi Electronics' business volume in Huawei has increased year by year in recent years, and it has been Huawei's main PCB supplier.

  • Qualcomm Huawei competes for 5G standard: the same day announced the completion of 5G connection under the new specification

    The dispute between Qualcomm and Huawei in 5G coding in 2016 has caused widespread concern.

  • Advantages and disadvantages of multilayer boards

    Multilayer boards were invented in 1961. Its production method is generally to make the inner layer graphics first, and then use the printing and etching method to make a single-sided or double-sided substrate, and incorporate it into the designated interlayer, and then heat, press and bond it. As for the subsequent drilling, It is the same as the plated through-hole method of the double-sided board.

  • Change of substrate size in PCB manufacturing process

    the difference between longitude and latitude causes the change of substrate size; Due to the failure to pay attention to the fiber direction during shearing, the shear stress remains in the substrate.

Send Inquiry