30-Layer Rigid-Flex PCB Manufacturers

Our goal will be to offer premium quality items at competitive price ranges, and top-notch support to consumers around the planet. We are ISO9001, CE, and GS certified and strictly adhere to their high quality specifications for 30-Layer Rigid-Flex PCB,22-Layer Rigid-Flex PCB,32-Layer Rigid-Flex PCB,36-Layer Rigid-Flex PCB,AP9141R Rigid-Flex PCB, Only for accomplish the good-quality product to meet customer's demand, all of our products have been strictly inspected before shipment.
30-Layer Rigid-Flex PCB, Our company always provides good quality and reasonable price for our customers. In our efforts, we already have many shops in Guangzhou and our solutions have won praise from customers worldwide. Our mission has always been simple: To delight our customers with best quality hair solutions and deliver on time. Welcome new and old customers to contact us for the future long term business relationships.

Hot Products

  • XC3S400-4FTG256C

    XC3S400-4FTG256C

    XC3S400-4FTG256C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XCVU11P-3FLGC2104E

    XCVU11P-3FLGC2104E

    ​XCVU11P-3FLGC2104E is an FPGA (Field Programmable Gate Array) chip launched by Xilinx, belonging to the Virtex UltraScale+series. This chip has been widely used in fields such as data centers, network communication, video and image processing due to its high performance, low power consumption, and flexibility.
  • XC5VLX155T-1FFG1136C

    XC5VLX155T-1FFG1136C

    XC5VLX155T-1FFG1136C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • 10AX027E3F29E2SG

    10AX027E3F29E2SG

    ​10AX027E3F29E2SG is an FPGA (Field Programmable Gate Array) product produced by Altera (now acquired by Intel), with the specific model being Arria 10 GX 270. This FPGA has the following features and specifications
  • 5CSXFC4C6U23I7N

    5CSXFC4C6U23I7N

    ​5CSXFC4C6U23I7N is an embedded system on chip (SoC) under Intel/Altera, belonging to the Cyclone V SX series. This product integrates the ARM Cortex-A9 MPCore processor, features dual cores, and comes with the CoreSight debugging system. Its RAM capacity is 64KB and it has rich peripheral interfaces
  • XC6SLX25-2FTG256C

    XC6SLX25-2FTG256C

    XC6SLX25-2FTG256C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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