36-Layer Rigid-Flex PCB Manufacturers

​XCAU10P-1FFVB676E is an Artix produced by AMD ® The UltraScale+series FPGA (Field Programmable Gate Array) chips are packaged in BGA-676 format. This chip features high performance, low power consumption, and high customizability, making it suitable for various high-performance application scenarios. The specific parameters of XCAU10P-1FFVB676E include:

​MT40A1G16TB-062EIT:F is a type of memory module commonly used in computer systems. It is a 1GB DDR3 SDRAM module manufactured by Micron Technology

XCZU4EG-1SFVC784E based on Xilinx ® UltraScale MPSoC architecture. This series of products integrates feature rich 64 bit quad core or dual core Arm ® Cortex-A53 and dual core Arm Cortex-R5F processing system (based on Xilinx) ® UltraScale MPSoC architecture). Processing System (PS) and Xilinx Programmable Logic (PL) UltraScale architecture. In addition, it also includes on-chip memory, multi port external memory interfaces, and rich peripheral connection interfaces.

XC3S1500L-4FGG320C ​Number of Logic Components: Based on the characteristics of the Spartan-3 series, this model may contain thousands to tens of thousands of logic components, but specific values need to be referred to in the data manual

XC6SLX9-3CSG225C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

EP2SGX130GF1508I4N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.