24-layer server Buried capacitance PCB Manufacturers

We can constantly satisfy our respected customers with our good high quality, good price tag and good support due to we have been additional specialist and extra hard-working and do it in cost-effective way for 24-layer server Buried capacitance PCB,multilayer Buried resistance PCB,Microphone Buried capacitance PCB,Buried capacitance PCB,24-Layer PCB, First company, we understand each other. Further more company, the trust is getting there. Our enterprise normally at your provider anytime.
24-layer server Buried capacitance PCB, At Existing, our solutions have been exported to more than sixty countries and different regions, such as Southeast Asia, America, Africa, Eastern Europe, Russia, Canada etc. We sincerely hope to establish wide contact with all potential customers both in China and the rest part of the world.

Hot Products

  • XC3S50AN-4TQG144I

    XC3S50AN-4TQG144I

    XC3S50AN-4TQG144I is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • MAX20050CATC/V+T

    MAX20050CATC/V+T

    MAX20050CATC/V+T is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EPM1270F256C5N

    EPM1270F256C5N

    EPM1270F256C5N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • Rogers Step PCB

    Rogers Step PCB

    Slots are formed on the surface of MDF or other plates to form decorative stripes or fixed pendants. The distance between the common groove board stripes is equal, it is processed by professional machine. Type for punching board.The following is about Rogers Step High Frequency PCB related, I hope to help you better understand Rogers Step PCB.
  • BCM88360A0IFSBLG

    BCM88360A0IFSBLG

    BCM88360A0IFSBLG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • Communication PCBA

    Communication PCBA

    Communication PCBA is the abbreviation of printed circuit board + assembly, that is to say, PCBA is the whole process of PCB SMT, then dip plug-in.

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