16-layer EM-370 PCB Manufacturers

We believe in: Innovation is our soul and spirit. Quality is our life. Customer need is our God for 16-layer EM-370 PCB,megtron4 high speed PCB,EM-370D high TG PCB,8MM Thick Megtron4 PCB,EM-370 PCB, Should additional details be required, please call us anytime!
16-layer EM-370 PCB, Our company insists on the principle of "Quality First, Sustainable Development", and takes "Honest Business, Mutual Benefits" as our developable goal. All members sincerely thank all old and new customers' support. We'll keep working hard and offering you the highest-quality goods and service.

Hot Products

  • XC3S250E-4FTG256C

    XC3S250E-4FTG256C

    XC3S250E-4FTG256C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7K325T-1FFG900I

    XC7K325T-1FFG900I

    ​XC7K325T-1FFG900I Hongtai Fast Electronics, 100% in stock, complete in categories, only producing original equipment with a 15 year reputation, providing a safe and reliable electronic component procurement platform
  • 10AX048E3F29E2SG

    10AX048E3F29E2SG

    10AX048E3F29E2SG is a field programmable gate array (FPGA) chip produced by Intel (formerly Altera brand, now under Intel), belonging to the Arria 10 series
  • XC7A75T-2FGG676C

    XC7A75T-2FGG676C

    ​XC7A75T-2FGG676C is an FPGA (Field Programmable Gate Array) chip produced by Xilinx. This chip belongs to the Xilinx 7 series FPGA, designed to meet all system requirements from low-cost, small size, cost sensitive, large-scale applications to ultra high end connection bandwidth, logic capacity, and signal processing. The XC7A75T-2FGG676C chip has the following characteristics and specifications
  • HI-8445PSI

    HI-8445PSI

    HI-8445PSI is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EP2S30F672I4N

    EP2S30F672I4N

    EP2S30F672I4N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.

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