12-layer ELIC HDI PCB Manufacturers

With our abundant experience and considerate products and services, we have been recognized to be a reputable supplier for a lot of global consumers for 12-layer ELIC HDI PCB,ELIC Rigid-Flex PCB,10-layer ELIC HDI PCB,8-layer ELIC HDI PCB,6-layer ELIC HDI PCB, We have been wanting forwards to creating long-term company interactions with around the world shoppers.
12-layer ELIC HDI PCB, With excellent merchandise, high quality service and sincere attitude of service, we ensure customer satisfaction and help customers create value for mutual benefit and create a win-win situation. Welcome customers all over the world to contact us or visit our company. We are going to satisfy you with our expert service!

Hot Products

  • XC7K160T-1FBG676I

    XC7K160T-1FBG676I

    XC7K160T-1FBG676I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU440-1FLGA2892C

    XCVU440-1FLGA2892C

    XCVU440-1FLGA2892C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 10M50DAF256I7G

    10M50DAF256I7G

    10M50DAF256I7G is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • HI-8282APJI

    HI-8282APJI

    HI-8282APJI is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • S1D13700F02A100

    S1D13700F02A100

    S1D13700F02A100 is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC3S2000-4FGG676C

    XC3S2000-4FGG676C

    XC3S2000-4FGG676C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.

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