10AX016E4F27I3SG Manufacturers

We are also specializing in improving the things management and QC method in order that we could retain terrific edge inside the fiercely-competitive small business for 10AX016E4F27I3SG, We are now looking forward to even greater cooperation with overseas customers based on mutual benefits. If you are interested in any of our products, please feel free to contact us for more details.
10AX016E4F27I3SG, We adopt advanced production equipment and technology, and perfect testing equipment and methods to ensure our product quality. With our high-level talents, scientific management, excellent teams, and attentive service, our products are favored by domestic and foreign customers. With your support, we will build a better tomorrow!

Hot Products

  • Aluminum nitride ceramic PCB

    Aluminum nitride ceramic PCB

    Aluminum nitride ceramic PCB is a ceramic material with aluminum nitride (AIN) as the main crystal phase, and then the metal circuit is etched on the aluminum nitride ceramic substrate, which is the aluminum nitride ceramic substrate. The thermal conductivity of aluminum nitride is several times higher than that of aluminum oxide, has good thermal shock resistance, and has excellent corrosion resistance. The following is aboutAluminum nitride ceramic, I hope to help you better understand Aluminum nitride ceramic.
  • R-5575 PCB

    R-5575 PCB

    R-5575 PCB--From the perspective of major manufacturers, the existing capacity of domestic major manufacturers is less than 2% of the global total demand. Although some manufacturers have invested in expanding production, the capacity growth of domestic HDI still can not meet the demand of rapid growth.
  • XC7VX690T-3FFG1761I

    XC7VX690T-3FFG1761I

    XC7VX690T-3FFG1761I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EP2C50F672I8N

    EP2C50F672I8N

    EP2C50F672I8N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XC7A100T-2FGG484C

    XC7A100T-2FGG484C

    XC7A100T-2FGG484C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • MT29TZZZ5D6DKFRL-107 W

    MT29TZZZ5D6DKFRL-107 W

    MT29TZZZ5D6DKFRL-107 W is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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