XCZU7EV-2FFVC1156I Manufacturers

We now have a specialist, efficiency workforce to deliver excellent service for our purchaser. We always follow the tenet of customer-oriented, details-focused for XCZU7EV-2FFVC1156I, Besides, our firm sticks to high quality and affordable cost, and we also present great OEM companies to many famous brands.
XCZU7EV-2FFVC1156I, Our company mission is that providing high quality and beautiful products with reasonable price and strive to gain 100% good reputation from our clients. We believe Profession achieves excellence! We welcome you to cooperate with us and grow up together.

Hot Products

EP3SL200F1152C3N
EP3SL200F1152C3N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
ACPL-M43T-500E
ACPL-M43T-500E is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
XCKU11P-2FFVA1156I
XCKU11P-2FFVA1156I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
XCV300E-6BG352C
XCV300E-6BG352C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
BCM56376A2KFSBG
BCM56376A2KFSBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
XCKU115-2FLVB2104E
XCKU115-2FLVB2104E is a high-end field-programmable gate array (FPGA) developed by Xilinx, a leading provider of advanced semiconductor technology. This device features 1,143,360 logic cells, 50 Mb of block RAM, 1,728 Digital Signal Processing (DSP) slices, and 2.2 million flip-flops. It operates on a 1.0V to 1.2V power supply and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of 1.5 GHz, making it one of the highest performing FPGAs in the market.

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China and the US "Hundred Days Plan" exposes How will the manufacturing industry be affected?
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Cutting, fillet, edging, baking, inner layer pretreatment, coating, exposure, DES (development, etching, film removal), punching, AOI inspection, VRS repair, browning, lamination, pressing, target drilling, Gong edge, drilling, copper plating, film pressing, printing, writing, surface treatment, final inspection, packaging and other processes are countless

XCZU7EV-2FFVC1156I Manufacturers

Related Products

Hot Products

EP3SL200F1152C3N

ACPL-M43T-500E

XCKU11P-2FFVA1156I

XCV300E-6BG352C

BCM56376A2KFSBG

XCKU115-2FLVB2104E

China and the US "Hundred Days Plan" exposes How will the manufacturing industry be affected?

"Electronic Manufacturing Pavilion" of Shenzhen Electronic Equipment Association will become the new highlight of CITE2017

Hongtai tells you why the more developed countries, the less support mobile payment?

What is the difference between FPC and PCB?

Intel's strongest black technology strikes: Flash cache debut

PCB production, you must pay attention to these matters

Coral 2023-08-09 21:56:32

Irene 2021-10-21 21:58:32

Meredith 2022-03-03 20:05:01

Faithe 2022-10-26 16:22:23

Penelope 2020-12-11 20:16:55

Joa 2022-01-26 15:16:23

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An Integrated Circuit (IC) functions by integrating various electronic components onto a semiconductor material, typically silicon.

After the board surface is oxidized, a fluff layer (copper oxide and cuprous oxide) is formed.