XCZU7EV-2FBVB900I Manufacturers

We also supply merchandise sourcing and flight consolidation companies. We now have our very own manufacturing facility and sourcing business. We could present you with almost every kind of product relevant to our solution array for XCZU7EV-2FBVB900I, Only for accomplish the good-quality product to meet customer's demand, all of our products have been strictly inspected before shipment.
XCZU7EV-2FBVB900I, We mainly sell in wholesale, with the most popular and easy ways of making payment, which are paying via Money Gram, Western Union, Bank Transfer and Paypal. For any further talk, just feel free to contact our salesmen, who are really good and knowledgeable about our prodcuts.

Hot Products

  • HI-3584APQT-15

    HI-3584APQT-15

    ​The features of HI-3584APQT-15 include ARINC 429 compatibility, high-speed 3.3V logic interface, offering 9mm x 9mm small chip level packaging, and dual receiver and transmitter interfaces. ‌
  • XCVU9P-L2FLGB2104E

    XCVU9P-L2FLGB2104E

    ​XCVU9P-L2FLGB2104E is a high-performance FPGA chip in Xilinx's Virtex UltraScale+series. The chip adopts advanced 28 nanometer high-K metal gate (HKMG) technology, combined with stacked silicon interconnect (SSI) technology, to achieve a perfect combination of low power consumption and high performance
  • EP4SGX230KF40C4N

    EP4SGX230KF40C4N

    EP4SGX230KF40C4N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU11P-1FLGC2104E

    XCVU11P-1FLGC2104E

    ​The XCVU11P-1FLGC2104E FPGA device provides the highest performance and integrated functionality on a 14nm/16nm FinFET node.
  • XCVU7P-1FLVA2104I

    XCVU7P-1FLVA2104I

    ​XCVU7P-1FLVA2104I is a Virtex ® UltraScale+Field Programmable Gate Array (FPGA) IC, with the highest performance and integrated functionality. AMD's third-generation 3D IC uses stacked silicon interconnect (SSI) technology to break the limitations of Moore's Law and achieve the highest signal processing and serial I/O bandwidth to meet the strictest design requirements.
  • Power amplifier PCB

    Power amplifier PCB

    Power amplifier PCB-The role of the power amplifier is to amplify the weak signal from the sound source or pre-amplifier, and promote the speaker to play sound. The function of a good sound system amplifier is indispensable.The following is about Microwave circuit board related, I hope to help you better understand Microwave circuit board.

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