XCZU7EG-1FBVB900I Manufacturers

To continually improve the management procedure by virtue in the rule of "sincerely, great religion and good quality are the base of company development", we commonly absorb the essence of associated products and solutions internationally, and regularly build new solutions to meet the calls for of consumers for XCZU7EG-1FBVB900I, We are really proud of your great name from our shoppers for our products' reputable quality.
XCZU7EG-1FBVB900I, We've got constantly insisted on the evolution of solutions, spent good funds and human resource in technological upgrading, and facilitate production improvement, meeting the wants of prospects from all countries and regions.

Hot Products

  • XC7Z010-1CLG400I

    XC7Z010-1CLG400I

    XC7Z010-1CLG400I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU190-2FLGB2104E

    XCVU190-2FLGB2104E

    XCVU190-2FLGB2104E is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XCZU6EG-1FFVC900E

    XCZU6EG-1FFVC900E

    ​XCZU6EG-1FFVC900E - Zynq® UltraScale+ ™ MPSoC multi-core processor
  • 2Step HDI PCB

    2Step HDI PCB

    According to the use of high-end HDI board-3G board or IC carrier board, its future growth is very rapid: the world's 3G mobile phone growth will exceed 30% in the next few years, China will soon issue 3G licenses; IC carrier board industry consulting agency Prismark predicts China's forecasted growth rate from 2005 to 2010 is 80%, which represents the development direction of PCB technology. The following is about 2Step HDI PCB related, I hope to help you better understand 2Step HDI PCB.
  • 10AS016E3F29I2SG

    10AS016E3F29I2SG

    10AS016E3F29I2SG is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XCVU440-2FLGA2892E

    XCVU440-2FLGA2892E

    XCVU440-2FLGA2892E is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.

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