XCZU7CG-1FFVF1517E Manufacturers

We support our consumers with ideal high-quality goods and substantial level support. Becoming the specialist manufacturer in this sector, we now have acquired abundant practical encounter in producing and managing for XCZU7CG-1FFVF1517E, Please truly feel absolutely free to call us at any time. We will reply you when we receive your inquiries. Please note that samples are available before we start our company.
XCZU7CG-1FFVF1517E, Besides strong technical strength, we also introduce advanced equipment for inspection and conduct strict management. All the staff of our company welcome friends both at home and abroad to come for visits and business on the basis of equality and mutual benefit. If you are interested in any of our objects, remember to feel free to contact us for quotation and product details.

Hot Products

  • MT25QU128ABA1EW9-0SIT

    MT25QU128ABA1EW9-0SIT

    MT25QU128ABA1EW9-0SIT is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • BCM53724B0KPB

    BCM53724B0KPB

    BCM53724B0KPB is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • AP9111R PCB

    AP9111R PCB

    The AP9111R PCB combines the advantages of the rigid characteristics of the rigid circuit board and the bendable characteristics of the flexible board, so that the PCB is no longer a two-dimensional plane layer of oil, but is folded by a three-dimensional internal connection and arbitrary bending. The following is about 12 Layer 8R4F Rigid Flex Board related, I hope to help you better understand 12 Layer AP9111R PCB.
  • 10AS016E3F29I2SG

    10AS016E3F29I2SG

    10AS016E3F29I2SG is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • BCM56150A0KFSBLG

    BCM56150A0KFSBLG

    BCM56150A0KFSBLG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • Megtron7 PCB

    Megtron7 PCB

    Megtron7 PCB--Panasonic automotive and Industrial Systems Corporation announced on May 28, 2014 that it has developed a low loss multilayer substrate material "Megtron 7" for high-end servers, routers and supercomputers with large capacity and high-speed transmission. The relative permittivity of the product is 3.3 (at 1GHz) and the dielectric loss tangent is 0.001 (at 1GHz). Compared with the original product "Megtron 6", the transmission loss is reduced by 20%.

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