XCVU9P-2FLGC2104I Manufacturers

We rely upon strategic thinking, constant modernisation in all segments, technological advances and of course upon our employees that directly participate in our success for XCVU9P-2FLGC2104I, Our aim is "blazing new ground, Passing Value", in the future, we sincerely invite you to grow up with us and make a bright future together!
XCVU9P-2FLGC2104I, We strive for excellence, constant improvement and innovation, is committed to make us the "customer trust" and the "first choice of engineering machinery accessories brand" suppliers. Choose us, sharing a win-win situation!

Hot Products

EP3SL200F1152C3N
EP3SL200F1152C3N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
ACPL-M43T-500E
ACPL-M43T-500E is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
XCKU11P-2FFVA1156I
XCKU11P-2FFVA1156I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
XCV300E-6BG352C
XCV300E-6BG352C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
BCM56376A2KFSBG
BCM56376A2KFSBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
XCKU115-2FLVB2104E
XCKU115-2FLVB2104E is a high-end field-programmable gate array (FPGA) developed by Xilinx, a leading provider of advanced semiconductor technology. This device features 1,143,360 logic cells, 50 Mb of block RAM, 1,728 Digital Signal Processing (DSP) slices, and 2.2 million flip-flops. It operates on a 1.0V to 1.2V power supply and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of 1.5 GHz, making it one of the highest performing FPGAs in the market.

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Cutting, fillet, edging, baking, inner layer pretreatment, coating, exposure, DES (development, etching, film removal), punching, AOI inspection, VRS repair, browning, lamination, pressing, target drilling, Gong edge, drilling, copper plating, film pressing, printing, writing, surface treatment, final inspection, packaging and other processes are countless

XCVU9P-2FLGC2104I Manufacturers

Related Products

Hot Products

EP3SL200F1152C3N

ACPL-M43T-500E

XCKU11P-2FFVA1156I

XCV300E-6BG352C

BCM56376A2KFSBG

XCKU115-2FLVB2104E

China and the US "Hundred Days Plan" exposes How will the manufacturing industry be affected?

"Electronic Manufacturing Pavilion" of Shenzhen Electronic Equipment Association will become the new highlight of CITE2017

Hongtai tells you why the more developed countries, the less support mobile payment?

What is the difference between FPC and PCB?

Intel's strongest black technology strikes: Flash cache debut

PCB production, you must pay attention to these matters

Delia 2022-03-26 19:49:39

Amelia 2022-05-21 17:19:27

Deirdre 2022-11-29 01:43:08

Tyler Larson 2020-10-26 08:55:36

Maxine 2024-06-23 16:22:04

Sara 2022-07-31 23:09:04

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An Integrated Circuit (IC) functions by integrating various electronic components onto a semiconductor material, typically silicon.

After the board surface is oxidized, a fluff layer (copper oxide and cuprous oxide) is formed.