Products
Home > Products > XCVU190-1FLGB2104I

XCVU190-1FLGB2104I Manufacturers

"Sincerity, Innovation, Rigorousness, and Efficiency" would be the persistent conception of our enterprise with the long-term to establish together with clients for mutual reciprocity and mutual benefit for XCVU190-1FLGB2104I, Our main objectives are to deliver our clients worldwide with good quality, competitive cost, happy delivery and superb providers.
XCVU190-1FLGB2104I, With high quality, reasonable price, on-time delivery and customized & personalized services to help customers achieve their goals successfully, our company has got praise in both domestic and foreign markets. Buyers are welcome to contact us.

Related Products

Hot Products

  • XC7A75T-2FGG676I

    XC7A75T-2FGG676I

    XC7A75T-2FGG676I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • BCM56041A0KFSBLG

    BCM56041A0KFSBLG

    BCM56041A0KFSBLG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 10AX027H3F35E2SG

    10AX027H3F35E2SG

    10AX027H3F35E2SG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • AD5752RBREZ

    AD5752RBREZ

    AD5752RBREZ is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EP3C55F780I7N

    EP3C55F780I7N

    EP3C55F780I7N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • 5SGXMA4H2F35I3LN

    5SGXMA4H2F35I3LN

    5SGXMA4H2F35I3LN is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • Related Blog
  • Reviews

  • Do you really know about FPCs

    According to the base material, PCB can be divided into flexible circuit board, rigid circuit board and rigid flexible combination plate, which are used in different equipment according to different purposes.

  • PCB proofing layout setting skills

    PCB proofing, as a component of high-precision electronic products, has been a very common existence in life. However, we all know that domestic professional PCB proofing design needs different point settings in different stages, and large grid points will be used for device layout in the layout stage. Let's take a look at the detailed PCB proofing layout setting skills.

  • Hongtai tells you why the more developed countries, the less support mobile payment?

    Hongtai tells you, why are people in these developed countries so keen on mobile payment as a convenient payment method? Because in their view, the "cashless era" with full coverage of mobile payments hides the danger of many dark waves.

  • Thermal stress treatment quality of heavy copper PCB

    When designing a circuit, factors such as thermal stress are very important, and engineers should eliminate thermal stress as much as possible. Over time, PCB manufacturing processes have continued to evolve, and various PCB technologies have been invented, such as aluminum PCBs, which can handle thermal stress. It is in the interests of heavy copper PCB designers to minimize the power budget while maintaining the circuit. Performance and environmentally friendly design with heat dissipation performance.

  • The origin of 50 ohms in impedance matching

    For traces with a certain width, three main factors will affect the impedance of PCB traces. First of all, the EMI (electromagnetic interference) of the near field of the PCB trace is proportional to the height of the trace from the reference plane. The lower the height, the smaller the radiation. Secondly, the crosstalk will change significantly with the height of the trace. If the height is reduced by half, the crosstalk will be reduced to nearly a quarter.

  • FPC soft board process introduction

    Overview of FPC soft board automatic production line

Send Inquiry