Products
Home > Products > XCVU11P-3FLGC2104E

XCVU11P-3FLGC2104E Manufacturers

We rely upon strategic thinking, constant modernisation in all segments, technological advances and of course upon our employees that directly participate in our success for XCVU11P-3FLGC2104E, Should you pursuit the Hi-quality, Hi-stable, Aggressive price tag parts, business name is your most effective choice!
XCVU11P-3FLGC2104E, Our solutions are mainly exported to Europe, Africa, America, the Middle East and Southeast Asia and other countries and regions. We now have enjoyed a great reputation among our customers for quality products and good services.We would make friends with businessmen from at home and abroad, following the purpose of "Quality First, Reputation First, the Best Services."

Related Products

Hot Products

  • TPS79318DBVR

    TPS79318DBVR

    TPS79318DBVR is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • MT62F1536M64D8WT-031 XT:B

    MT62F1536M64D8WT-031 XT:B

    MT62F1536M64D8WT-031 XT:B is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • MT47H64M8SH-25E:H

    MT47H64M8SH-25E:H

    ​MT47H64M8SH-25E:H is a type of synchronous dynamic random-access memory (SDRAM) chip produced by Micron Technology. It has a capacity of 512 megabytes (MB) and a maximum clock speed of 200 megahertz (MHz). The chip operates at a voltage of 2.5
  • MT41K512M16HA-125 AIT:A

    MT41K512M16HA-125 AIT:A

    MT41K512M16HA-125 AIT:A is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC3S200AN-4FTG256C

    XC3S200AN-4FTG256C

    XC3S200AN-4FTG256C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • TU-1300E PCB

    TU-1300E PCB

    TU-1300E PCB -- expedition unified design environment combines FPGA design and PCB design completely, and automatically generates schematic symbols and geometric packaging in PCB design from FPGA design results, which greatly improves the design efficiency of designers.
  • Related Blog
  • Reviews

  • How to solve the problem of high-end PCB proofing

    As we all know, the competition in China's PCB manufacturing industry is very fierce. A complete industrial chain has been formed from a series of processes such as PCB proofing, mass production, packaging and transportation. In recent years, through extensive and rapid development and cruel market competition, the basic pattern of China's PCB industry has been formed. Relevant data show that by 2020, the number of PCB enterprises in Chinese Mainland alone will reach more than 2000, an amazing number.

  • What is an HDI (High Density Interconnect) PCB?

    High Density Interconnection (HDI) PCB is a kind of (technology) for the production of printed circuit boards. It is a circuit board with relatively high circuit distribution density using micro blind via and buried via technology.

  • Today, we will talk about the knowledge related to chips, hoping to provide some help for everyone to understand chips!

    1. Introduction to chips What is a chip? A chip is an integrated circuit that can be compared to the brain of an electronic device. The components on a chip can perform various tasks, such as processing information, storing data, performing calculations, and controlling operations. Why is it called a chip? "Core" represents the core and center, and "chip" represents a thin piece or fragment. A chip is a thin piece made of semiconductor materials, which, as the core part of the entire circuit system, integrates key circuit structures.

  • Do you really know about FPCs

    of FPC is becoming more and more significant in order to achieve more functions. Now Jin Baize will talk about the characteristics of FPC on the advantages and disadvantages of FPC.

  • Introduction to semiconductors

    After the invention and mass production of transistors, various solid-state semiconductor components such as diodes and transistors were widely used, replacing the functions and roles of vacuum tubes in circuits. By the middle and late 20th century

  • What is RF PCB board?

    RF PCB, means radio frequency PCB. People also called these PCB High frequency PCB, it is for the PCB with a higher electromagnetic frequency, and it is used on the products field with high frequency. (Frequency greater than 300MHZ or wavelength less than 1 meter) and microwave (frequency greater than 3GHZ or wavelength less than 0.1 meter). It is made by microwave substrate with common PCB manufacturing process or with some special way to make.

Send Inquiry