XCVU11P-1FLGB2104I Manufacturers

Using a complete scientific high quality management program, superior high quality and superior faith, we acquire great reputation and occupied this industry for XCVU11P-1FLGB2104I, 1st business enterprise, we find out each other. Even further business enterprise, the trust is getting there. Our enterprise always at your services at any time.
XCVU11P-1FLGB2104I, Based on our automatic production line, steady material purchase channel and quick subcontract systems have been built in mainland China to meet customer's wider and higher requirement in recent years. We have been looking forward to cooperating with more clients worldwide for common development and mutual benefit!Your trust and approval are the best reward for our efforts. Keeping honest, innovative and efficient, we sincerely expect that we can be business partners to create our brilliant future!

Hot Products

  • XC6VLX550T-2FFG1759C

    XC6VLX550T-2FFG1759C

    XC6VLX550T-2FFG1759C is an FPGA (Field Programmable Gate Array) chip produced by Xilinx, which belongs to the LXT sub series of the Virtex-6 series. Here is a detailed introduction to the chip:
  • AD4134BCPZ

    AD4134BCPZ

    AD4134BCPZ is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU19P-2FSVA3824E

    XCVU19P-2FSVA3824E

    Part status: Active LAB/CLB number: 510720 Logic components/units number: 8937600 Total RAM bits: 79586918I/O number: 1976 Number of gates: - Voltage - XCVU19P-2FSVA3824E Power supply: 0.825V~0.876V Installation type: Surface mount type Working temperature: 0 ° C~100 ° C (TJ) Product packaging: 3824-BBGA, FCBGA
  • BCM54680B0KFBG

    BCM54680B0KFBG

    BCM54680B0KFBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • LTC2854HDD#PBF

    LTC2854HDD#PBF

    LTC2854HDD#PBF is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU7P-2FLVA2104I

    XCVU7P-2FLVA2104I

    The XCVU7P-2FLVA2104I device provides the highest performance and integrated functionality on 14nm/16nm FinFET nodes. AMD's third-generation 3D IC uses stacked silicon interconnect (SSI) technology to break the limitations of Moore's Law and achieve the highest signal processing and serial I/O bandwidth to meet the strictest design requirements. It also provides a virtual single-chip design environment to provide registered routing lines between chips to achieve operation above 600MHz and provide richer and more flexible clocks.

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