XCKU9P-2FFVE900I Manufacturers

Quality comes first; service is foremost; business is cooperation" is our business philosophy which is constantly observed and pursued by our company for XCKU9P-2FFVE900I, Welcome your visiting and any your inquires,sincerely hope we can have chance to cooperate with you and we can build up long well business relationship with you.
XCKU9P-2FFVE900I, With many years good service and development, we've a professional international trade sales team. Our products and solutions have exported to North America, Europe, Japan, Korea, Australia, New Zealand, Russia and other countries. Looking forward to build up a good and long term cooperation with you in coming future!

Hot Products

  • XCKU035-2FFVA1156I

    XCKU035-2FFVA1156I

    XCKU035-2FFVA1156I ​Xilinx XCKU035-1FFVA1156I Kintex® UltraScale ™ Field programmable gate arrays can achieve extremely high signal processing bandwidth in mid-range devices and next-generation transceivers. FPGA is a semiconductor device based on a configurable logic block (CLB) matrix connected through a programmable interconnect system
  • BCM68652A1IFSBG

    BCM68652A1IFSBG

    BCM68652A1IFSBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • HCMS-2975

    HCMS-2975

    HCMS-2975 is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • AD7653ASTZ

    AD7653ASTZ

    AD7653ASTZ is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • ELIC Rigid-Flex PCB

    ELIC Rigid-Flex PCB

    ELIC Rigid-Flex PCB is the interconnection hole technology in any layer. This technology is the patent process of Matsushita Electric Component in Japan. It is made of short fiber paper of DuPont's "poly aramid" product thermount, which is impregnated with high-function epoxy resin and film. Then it is made of laser hole forming and copper paste, and copper sheet and wire are pressed on both sides to form a conductive and interconnected double-sided plate. Because there is no electroplated copper layer in this technology, the conductor is only made of copper foil, and the thickness of the conductor is the same, which is conducive to the formation of finer wires.
  • AM29F800BB-70EI

    AM29F800BB-70EI

    AM29F800BB-70EI is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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