XCKU3P-1FFVD900I Manufacturers

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XCKU3P-1FFVD900I, With high quality, reasonable price, on-time delivery and customized & customized services to help customers achieve their goals successfully, our company has got praise in both domestic and foreign markets. Buyers are welcome to contact us.

Hot Products

  • F4B Antenna PCB

    F4B Antenna PCB

    The F4B Antenna PCB includes a core board provided with a hollow groove and a copper-clad plate adhered to the upper and lower surfaces of the core board by flow glue, and edges of the upper and lower openings of the hollow groove are provided with ribs.The following is about Antenna circuit board related, I hope to help you better understand Antenna circuit board.
  • TPS63060DSCR

    TPS63060DSCR

    TPS63060DSCR is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC9572XL-7VQ44I

    XC9572XL-7VQ44I

    ​XC9572XL-7VQ44I is a complex programmable logic device (CPLD) produced by Xilinx. This chip has high flexibility and scalability, supporting programming using HDL (Hardware Description Language) such as VHDL and Verilog to meet various complex functional requirements.
  • 8 Layer Robot HDI PCB

    8 Layer Robot HDI PCB

    HDI boards are generally manufactured using a lamination method. The more laminations, the higher the technical level of the board. Ordinary HDI boards are basically laminated one time. High-level HDI adopts two or more layered technologies. At the same time, advanced PCB technologies such as stacked holes, electroplated holes, and direct laser drilling are used. The following is about 8 Layer Robot HDI PCB related, I hope to help you better understand 8 Layer Robot HDI PCB.
  • ADV7391WBCPZ

    ADV7391WBCPZ

    ADV7391WBCPZ is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7V585T-2FFG1761C

    XC7V585T-2FFG1761C

    XC7V585T-2FFG1761C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.

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