XCKU115-L1FLVB2104I Manufacturers

Our organization puts emphasis to the administration, the introduction of talented personnel, and also the construction of team building, making an attempt hard to enhance the standard and liability consciousness of workers members. Our business successfully attained IS9001 Certification and European CE Certification of XCKU115-L1FLVB2104I, Initial enterprise, we understand each other. Additional enterprise, the trust is getting there. Our firm usually at your service anytime.
XCKU115-L1FLVB2104I, Our next goal is to exceed the expectations of every client by offering outstanding customer service, increased flexibility and greater value. All in all, without our customers we do not exist; without happy and fully satisfied customers, we fail. We're looking for the wholesale, Drop ship. Make sure you contact us if you are interesting our solutions. Hope to do business with you all. High quality and fast shipment!

Hot Products

  • XC6SLX100-3FGG900C

    XC6SLX100-3FGG900C

    XC6SLX100-3FGG900C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU13P-2FHGA2104I

    XCVU13P-2FHGA2104I

    XCVU13P-2FHGA2104I is a scalable and reconfigurable acceleration platform suitable for optimizing complex workloads. It has a large amount of raw computing power and I/O flexibility, suitable for computationally intensive workloads in data center applications
  • XC6SLX150-3FGG484I

    XC6SLX150-3FGG484I

    ​XC6SLX150-3FGG484I is a high-performance, low-power FPGA chip produced by Xilinx, belonging to the Spartan-6 series. This chip adopts advanced manufacturing processes and has the characteristics of high integration and small size. Its main frequency reaches a certain level and can cope with complex computing tasks.
  • XC2S300E-6FGG456C

    XC2S300E-6FGG456C

    XC2S300E-6FGG456C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • Teflon PCB

    Teflon PCB

    Teflon PCB (also called PTFE board, Teflon board, Teflon board) is divided into two kinds of molding and turning. The molding board is made of PTFE resin at room temperature by molding, and then sintered, Made by cooling. The PTFE turning plate is made of PTFE resin through compacting, sintering and rotary cutting.
  • XC7A50T-2FGG484C

    XC7A50T-2FGG484C

    XC7A50T-2FGG484C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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