XC7S75-2FGGA676I Manufacturers

Our personnel are generally in the spirit of "continuous improvement and excellence", and together with the outstanding top quality merchandise, favorable price tag and fantastic after-sales solutions, we try to gain every single customer's rely on for XC7S75-2FGGA676I, Warmly welcome to cooperate and develop with us! we will continue to provide product with high quality and competitive price.
XC7S75-2FGGA676I, Our company insists on the principle of "Quality First, Sustainable Development", and takes "Honest Business, Mutual Benefits" as our developable goal. All members sincerely thank all old and new customers' support. We'll keep working hard and offering you the highest-quality goods and service.

Hot Products

  • EM-370 HDI PCB

    EM-370 HDI PCB

    EM-370 HDI PCB--From the perspective of major manufacturers, the existing capacity of domestic major manufacturers is less than 2% of the global total demand. Although some manufacturers have invested in expanding production, the capacity growth of domestic HDI still can not meet the demand of rapid growth.
  • MT41K512M8DA-107:P

    MT41K512M8DA-107:P

    MT41K512M8DA-107:P is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • FPC flexible board

    FPC flexible board

    FPC flexible board is a kind of flexible printed circuit board which is made of polyimide or polyester film with high reliability and excellent flexibility. It has the characteristics of high density, light weight, thin thickness and good bending property.
  • Multilayer PCB circuit board

    Multilayer PCB circuit board

    Multilayer PCB circuit board--The manufacturing method of multilayer board is generally made by the inner layer pattern first, and then the single or double-sided substrate is made by printing and etching method, which is included in the designated interlayer, and then heated, pressurized and bonded. As for the subsequent drilling, it is the same as the plating through-hole method of double-sided plate. It was invented in 1961.
  • XCVU095-1FFVC2104I

    XCVU095-1FFVC2104I

    XCVU095-1FFVC2104I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC6SLX45-2CSG324I

    XC6SLX45-2CSG324I

    XC6SLX45-2CSG324I is a type of FPGA (Field Programmable Gate Array) made by Xilinx. This specific FPGA has 43,661 Logic Cells, operates at a speed of up to 400 MHz, and features 1.3 Mb of Block RAM, 180 DSP Slices, and 167 user I/Os.

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