XC7S75-2FGGA676I Manufacturers

Our personnel are generally in the spirit of "continuous improvement and excellence", and together with the outstanding top quality merchandise, favorable price tag and fantastic after-sales solutions, we try to gain every single customer's rely on for XC7S75-2FGGA676I, Warmly welcome to cooperate and develop with us! we will continue to provide product with high quality and competitive price.
XC7S75-2FGGA676I, Our company insists on the principle of "Quality First, Sustainable Development", and takes "Honest Business, Mutual Benefits" as our developable goal. All members sincerely thank all old and new customers' support. We'll keep working hard and offering you the highest-quality goods and service.

Hot Products

  • BCM56820B0KFSBLG

    BCM56820B0KFSBLG

    BCM56820B0KFSBLG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • ADG5412FBCPZ

    ADG5412FBCPZ

    ADG5412FBCPZ is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC2S300E-6FGG456C

    XC2S300E-6FGG456C

    XC2S300E-6FGG456C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • car Ceramic PCB

    car Ceramic PCB

    car Ceramic PCB is an ideal material for large-scale integrated circuits, semiconductor module circuits and high-power devices, heat dissipation materials, circuit components and interconnection line carriers.The following is about New energy car ceramic board, I hope to help you better understand New energy car ceramic board.
  • EP3SL200H780I5

    EP3SL200H780I5

    EP3SL200H780I5 is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCF08PFS48C

    XCF08PFS48C

    XCF08PFS48C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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