XC7S25-2CSGA225I Manufacturers

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Hot Products

  • SS20-0B00-00

    SS20-0B00-00

    SS20-0B00-00 is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7V585T-2FFG1761C

    XC7V585T-2FFG1761C

    XC7V585T-2FFG1761C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XC3S500E-4FGG320C

    XC3S500E-4FGG320C

    XC3S500E-4FGG320C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • AD9057BRSZ-80

    AD9057BRSZ-80

    AD9057BRSZ-80 is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EP3C10E144I7N

    EP3C10E144I7N

    ​EP3C10E144I7N FPGA Field Programmable Logic Device Altera Packaging Original Factory Packaging Batch 22+
  • 2Step HDI PCB

    2Step HDI PCB

    According to the use of high-end HDI board-3G board or IC carrier board, its future growth is very rapid: the world's 3G mobile phone growth will exceed 30% in the next few years, China will soon issue 3G licenses; IC carrier board industry consulting agency Prismark predicts China's forecasted growth rate from 2005 to 2010 is 80%, which represents the development direction of PCB technology. The following is about 2Step HDI PCB related, I hope to help you better understand 2Step HDI PCB.

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