XC7S15-1FTGB196C Manufacturers

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Hot Products

  • EP2AGX190EF29C6G

    EP2AGX190EF29C6G

    EP2AGX190EF29C6G is a high-performance field programmable gate array (FPGA) chip produced by Intel (formerly Altera, now acquired by Intel), belonging to the Arria II GX series
  • MT40A1G16TB-062E IT:F

    MT40A1G16TB-062E IT:F

    MT40A1G16TB-062E IT:F is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 5AGXFB7K4F40C4N

    5AGXFB7K4F40C4N

    5AGXFB7K4F40C4N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU095-2FFVC2104E

    XCVU095-2FFVC2104E

    ​The XCVU095-2FFVC2104E device provides optimal performance and integration at 20nm, including serial I/O bandwidth and logic capacity. As the only high-end FPGA in the 20nm process node industry, this series is suitable for applications ranging from 400G networks to large-scale ASIC prototype design/simulation.
  • XCKU115-L1FLVD1924I

    XCKU115-L1FLVD1924I

    XCKU115-L1FLVD1924I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 28Layer 185HR PCB

    28Layer 185HR PCB

    28Layer 185HR PCB While electronic design is constantly improving the performance of the whole machine, it is also trying to reduce its size. In small portable products from mobile phones to smart weapons, "small" is a constant pursuit. High-density integration (HDI) technology can make the design of end products more compact while meeting higher standards of electronic performance and efficiency. The following is about 28 Layer 3step HDI Circuit Board related, I hope to help you better understand 28 Layer 3step HDI Circuit Board.

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